수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스
환화 수지 또는 그 전구체, 및, 함질소 화합물을 포함하고, 상기 함질소 화합물은, 함질소 헤테로환과 아미노기를 동일 화합물 내에 포함하며, 상기 아미노기의 수소 원자 중 하나는 치환되어 있어도 되고, 상기 함질소 헤테로환의 환원인 질소 원자 중 적어도 하나는 카보닐기, 설폰일기, 또는, 싸이오카보닐기에 직접 결합되어 있는 수지 조성물, 상기 수지 조성물을 경화하여 이루어지는 경화물, 상기 경화물을 포함하는 적층체, 상기 경화물의 제조 방법, 및, 상기 경화물 또는 상기 적층체를 포함하는 반도체 디바이스. A resin compos...
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| creator | OGAWA MICHIHIRO |
| description | 환화 수지 또는 그 전구체, 및, 함질소 화합물을 포함하고, 상기 함질소 화합물은, 함질소 헤테로환과 아미노기를 동일 화합물 내에 포함하며, 상기 아미노기의 수소 원자 중 하나는 치환되어 있어도 되고, 상기 함질소 헤테로환의 환원인 질소 원자 중 적어도 하나는 카보닐기, 설폰일기, 또는, 싸이오카보닐기에 직접 결합되어 있는 수지 조성물, 상기 수지 조성물을 경화하여 이루어지는 경화물, 상기 경화물을 포함하는 적층체, 상기 경화물의 제조 방법, 및, 상기 경화물 또는 상기 적층체를 포함하는 반도체 디바이스.
A resin composition including a cyclic resin or a precursor thereof and a nitrogen-containing compound, in which the nitrogen-containing compound includes a nitrogen-containing heterocycle and an amino group in the same compound, one of the hydrogen atoms of the amino group may be substituted, and at least one of the nitrogen atoms which is a ring member of the nitrogen-containing heterocycle bonds directly to a carbonyl group, sulfonyl group, or thiocarbonyl group; a cured product obtained by curing the resin composition; a laminate including the cured product; a method for producing the cured product; and a semiconductor device that includes the cured product or the laminate. |
| format | Patent |
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A resin composition including a cyclic resin or a precursor thereof and a nitrogen-containing compound, in which the nitrogen-containing compound includes a nitrogen-containing heterocycle and an amino group in the same compound, one of the hydrogen atoms of the amino group may be substituted, and at least one of the nitrogen atoms which is a ring member of the nitrogen-containing heterocycle bonds directly to a carbonyl group, sulfonyl group, or thiocarbonyl group; a cured product obtained by curing the resin composition; a laminate including the cured product; a method for producing the cured product; and a semiconductor device that includes the cured product or the laminate.</description><language>kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230726&DB=EPODOC&CC=KR&NR=20230112132A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230726&DB=EPODOC&CC=KR&NR=20230112132A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGAWA MICHIHIRO</creatorcontrib><title>수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스</title><description>환화 수지 또는 그 전구체, 및, 함질소 화합물을 포함하고, 상기 함질소 화합물은, 함질소 헤테로환과 아미노기를 동일 화합물 내에 포함하며, 상기 아미노기의 수소 원자 중 하나는 치환되어 있어도 되고, 상기 함질소 헤테로환의 환원인 질소 원자 중 적어도 하나는 카보닐기, 설폰일기, 또는, 싸이오카보닐기에 직접 결합되어 있는 수지 조성물, 상기 수지 조성물을 경화하여 이루어지는 경화물, 상기 경화물을 포함하는 적층체, 상기 경화물의 제조 방법, 및, 상기 경화물 또는 상기 적층체를 포함하는 반도체 디바이스.
A resin composition including a cyclic resin or a precursor thereof and a nitrogen-containing compound, in which the nitrogen-containing compound includes a nitrogen-containing heterocycle and an amino group in the same compound, one of the hydrogen atoms of the amino group may be substituted, and at least one of the nitrogen atoms which is a ring member of the nitrogen-containing heterocycle bonds directly to a carbonyl group, sulfonyl group, or thiocarbonyl group; a cured product obtained by curing the resin composition; a laminate including the cured product; a method for producing the cured product; and a semiconductor device that includes the cured product or the laminate.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh_0zHjzfIGhTcLN7xp2fh6zR4dhVeb9r6dOQXMfLOg8c2OrW82bUESfTN3BlB8DlCDwusNK19vmqoDpPtBxIzX_S1AtQqvp0x5vWHKm7lb3nQt4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGxgaGhkaGxkaOxsSpAgB-GFdW</recordid><startdate>20230726</startdate><enddate>20230726</enddate><creator>OGAWA MICHIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20230726</creationdate><title>수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스</title><author>OGAWA MICHIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230112132A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>OGAWA MICHIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGAWA MICHIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스</title><date>2023-07-26</date><risdate>2023</risdate><abstract>환화 수지 또는 그 전구체, 및, 함질소 화합물을 포함하고, 상기 함질소 화합물은, 함질소 헤테로환과 아미노기를 동일 화합물 내에 포함하며, 상기 아미노기의 수소 원자 중 하나는 치환되어 있어도 되고, 상기 함질소 헤테로환의 환원인 질소 원자 중 적어도 하나는 카보닐기, 설폰일기, 또는, 싸이오카보닐기에 직접 결합되어 있는 수지 조성물, 상기 수지 조성물을 경화하여 이루어지는 경화물, 상기 경화물을 포함하는 적층체, 상기 경화물의 제조 방법, 및, 상기 경화물 또는 상기 적층체를 포함하는 반도체 디바이스.
A resin composition including a cyclic resin or a precursor thereof and a nitrogen-containing compound, in which the nitrogen-containing compound includes a nitrogen-containing heterocycle and an amino group in the same compound, one of the hydrogen atoms of the amino group may be substituted, and at least one of the nitrogen atoms which is a ring member of the nitrogen-containing heterocycle bonds directly to a carbonyl group, sulfonyl group, or thiocarbonyl group; a cured product obtained by curing the resin composition; a laminate including the cured product; a method for producing the cured product; and a semiconductor device that includes the cured product or the laminate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스 |
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