cleaning liquid nozzle

A cleaning liquid nozzle, a cleaning device, and a method for manufacturing semiconductor devices using the same. The cleaning device comprises: a gas supply unit which supplies gas; a cleaning liquid supply unit which supplies cleaning liquid; and a nozzle which is connected to the gas supply unit...

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Hauptverfasser: KIM YUNGJUN, KIM HO YOUNG, HAN SOL, KIM TAE HONG, YOON BOUN, KIM JOONOH, KIM CHAE LYOUNG
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Sprache:eng ; kor
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creator KIM YUNGJUN
KIM HO YOUNG
HAN SOL
KIM TAE HONG
YOON BOUN
KIM JOONOH
KIM CHAE LYOUNG
description A cleaning liquid nozzle, a cleaning device, and a method for manufacturing semiconductor devices using the same. The cleaning device comprises: a gas supply unit which supplies gas; a cleaning liquid supply unit which supplies cleaning liquid; and a nozzle which is connected to the gas supply unit and the cleaning liquid supply unit, and creates a spray of the liquid on a substrate to clean the substrate. The nozzle includes: a nozzle body; a gas inlet which is located at the top of the nozzle body and connected to the gas supply unit; a first cleaning liquid inlet which is placed on one side wall of the nozzle body and connected to the cleaning liquid supply unit; and a fluid ejector which is located at the bottom of the nozzle body, and discharges the gas and the cleaning liquid. The fluid ejector may have a diameter larger than that of the first cleaning liquid inlet. Therefore, the cleaning liquid nozzle can increase the efficiency of particle removal to more than 98%. 본 발명은 세정액 노즐, 세정 장치 및 그를 이용한 반도체 소자의 제조방법을 개시한다. 그의 장치는, 가스를 공급하는 가스 공급부와, 세정액을 공급하는 세정액 공급부와, 상기 가스 공급부와, 상기 세정액 공급부에 연결되고, 기판 상에 상기 액체의 스프레이를 생성하여 상기 기판을 세정하는 노즐을 포함한다. 상기 노즐은 노즐 바디와, 상기 노즐 바디의 상단에 배치되고, 상기 가스 공급부에 연결되는 가스 주입구와, 상기 노즐 바디의 일측 측벽에 배치되고, 상기 세정액 공급부에 연결되는 제 1 세정액 주입구와, 상기 노즐 바디의 하단에 배치되고, 상기 가스와 상기 세정액을 토출하는 유체 분사구를 포함할 수 있다. 상기 유체 분사구는 상기 제 1 세정액 주입구의 직경보다 큰 직경을 가질 수 있다.
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The cleaning device comprises: a gas supply unit which supplies gas; a cleaning liquid supply unit which supplies cleaning liquid; and a nozzle which is connected to the gas supply unit and the cleaning liquid supply unit, and creates a spray of the liquid on a substrate to clean the substrate. The nozzle includes: a nozzle body; a gas inlet which is located at the top of the nozzle body and connected to the gas supply unit; a first cleaning liquid inlet which is placed on one side wall of the nozzle body and connected to the cleaning liquid supply unit; and a fluid ejector which is located at the bottom of the nozzle body, and discharges the gas and the cleaning liquid. The fluid ejector may have a diameter larger than that of the first cleaning liquid inlet. Therefore, the cleaning liquid nozzle can increase the efficiency of particle removal to more than 98%. 본 발명은 세정액 노즐, 세정 장치 및 그를 이용한 반도체 소자의 제조방법을 개시한다. 그의 장치는, 가스를 공급하는 가스 공급부와, 세정액을 공급하는 세정액 공급부와, 상기 가스 공급부와, 상기 세정액 공급부에 연결되고, 기판 상에 상기 액체의 스프레이를 생성하여 상기 기판을 세정하는 노즐을 포함한다. 상기 노즐은 노즐 바디와, 상기 노즐 바디의 상단에 배치되고, 상기 가스 공급부에 연결되는 가스 주입구와, 상기 노즐 바디의 일측 측벽에 배치되고, 상기 세정액 공급부에 연결되는 제 1 세정액 주입구와, 상기 노즐 바디의 하단에 배치되고, 상기 가스와 상기 세정액을 토출하는 유체 분사구를 포함할 수 있다. 상기 유체 분사구는 상기 제 1 세정액 주입구의 직경보다 큰 직경을 가질 수 있다.</description><language>eng ; kor</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; NOZZLES ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230718&amp;DB=EPODOC&amp;CC=KR&amp;NR=20230107760A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230718&amp;DB=EPODOC&amp;CC=KR&amp;NR=20230107760A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM YUNGJUN</creatorcontrib><creatorcontrib>KIM HO YOUNG</creatorcontrib><creatorcontrib>HAN SOL</creatorcontrib><creatorcontrib>KIM TAE HONG</creatorcontrib><creatorcontrib>YOON BOUN</creatorcontrib><creatorcontrib>KIM JOONOH</creatorcontrib><creatorcontrib>KIM CHAE LYOUNG</creatorcontrib><title>cleaning liquid nozzle</title><description>A cleaning liquid nozzle, a cleaning device, and a method for manufacturing semiconductor devices using the same. The cleaning device comprises: a gas supply unit which supplies gas; a cleaning liquid supply unit which supplies cleaning liquid; and a nozzle which is connected to the gas supply unit and the cleaning liquid supply unit, and creates a spray of the liquid on a substrate to clean the substrate. The nozzle includes: a nozzle body; a gas inlet which is located at the top of the nozzle body and connected to the gas supply unit; a first cleaning liquid inlet which is placed on one side wall of the nozzle body and connected to the cleaning liquid supply unit; and a fluid ejector which is located at the bottom of the nozzle body, and discharges the gas and the cleaning liquid. The fluid ejector may have a diameter larger than that of the first cleaning liquid inlet. Therefore, the cleaning liquid nozzle can increase the efficiency of particle removal to more than 98%. 본 발명은 세정액 노즐, 세정 장치 및 그를 이용한 반도체 소자의 제조방법을 개시한다. 그의 장치는, 가스를 공급하는 가스 공급부와, 세정액을 공급하는 세정액 공급부와, 상기 가스 공급부와, 상기 세정액 공급부에 연결되고, 기판 상에 상기 액체의 스프레이를 생성하여 상기 기판을 세정하는 노즐을 포함한다. 상기 노즐은 노즐 바디와, 상기 노즐 바디의 상단에 배치되고, 상기 가스 공급부에 연결되는 가스 주입구와, 상기 노즐 바디의 일측 측벽에 배치되고, 상기 세정액 공급부에 연결되는 제 1 세정액 주입구와, 상기 노즐 바디의 하단에 배치되고, 상기 가스와 상기 세정액을 토출하는 유체 분사구를 포함할 수 있다. 상기 유체 분사구는 상기 제 1 세정액 주입구의 직경보다 큰 직경을 가질 수 있다.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBLzklNzMvMS1fIySwszUxRyMuvqspJ5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGxgaGBubmZgaOxsSpAgAygyJ8</recordid><startdate>20230718</startdate><enddate>20230718</enddate><creator>KIM YUNGJUN</creator><creator>KIM HO YOUNG</creator><creator>HAN SOL</creator><creator>KIM TAE HONG</creator><creator>YOON BOUN</creator><creator>KIM JOONOH</creator><creator>KIM CHAE LYOUNG</creator><scope>EVB</scope></search><sort><creationdate>20230718</creationdate><title>cleaning liquid nozzle</title><author>KIM YUNGJUN ; KIM HO YOUNG ; HAN SOL ; KIM TAE HONG ; YOON BOUN ; KIM JOONOH ; KIM CHAE LYOUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230107760A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM YUNGJUN</creatorcontrib><creatorcontrib>KIM HO YOUNG</creatorcontrib><creatorcontrib>HAN SOL</creatorcontrib><creatorcontrib>KIM TAE HONG</creatorcontrib><creatorcontrib>YOON BOUN</creatorcontrib><creatorcontrib>KIM JOONOH</creatorcontrib><creatorcontrib>KIM CHAE LYOUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM YUNGJUN</au><au>KIM HO YOUNG</au><au>HAN SOL</au><au>KIM TAE HONG</au><au>YOON BOUN</au><au>KIM JOONOH</au><au>KIM CHAE LYOUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>cleaning liquid nozzle</title><date>2023-07-18</date><risdate>2023</risdate><abstract>A cleaning liquid nozzle, a cleaning device, and a method for manufacturing semiconductor devices using the same. The cleaning device comprises: a gas supply unit which supplies gas; a cleaning liquid supply unit which supplies cleaning liquid; and a nozzle which is connected to the gas supply unit and the cleaning liquid supply unit, and creates a spray of the liquid on a substrate to clean the substrate. The nozzle includes: a nozzle body; a gas inlet which is located at the top of the nozzle body and connected to the gas supply unit; a first cleaning liquid inlet which is placed on one side wall of the nozzle body and connected to the cleaning liquid supply unit; and a fluid ejector which is located at the bottom of the nozzle body, and discharges the gas and the cleaning liquid. The fluid ejector may have a diameter larger than that of the first cleaning liquid inlet. Therefore, the cleaning liquid nozzle can increase the efficiency of particle removal to more than 98%. 본 발명은 세정액 노즐, 세정 장치 및 그를 이용한 반도체 소자의 제조방법을 개시한다. 그의 장치는, 가스를 공급하는 가스 공급부와, 세정액을 공급하는 세정액 공급부와, 상기 가스 공급부와, 상기 세정액 공급부에 연결되고, 기판 상에 상기 액체의 스프레이를 생성하여 상기 기판을 세정하는 노즐을 포함한다. 상기 노즐은 노즐 바디와, 상기 노즐 바디의 상단에 배치되고, 상기 가스 공급부에 연결되는 가스 주입구와, 상기 노즐 바디의 일측 측벽에 배치되고, 상기 세정액 공급부에 연결되는 제 1 세정액 주입구와, 상기 노즐 바디의 하단에 배치되고, 상기 가스와 상기 세정액을 토출하는 유체 분사구를 포함할 수 있다. 상기 유체 분사구는 상기 제 1 세정액 주입구의 직경보다 큰 직경을 가질 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; kor
recordid cdi_epo_espacenet_KR20230107760A
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subjects APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
NOZZLES
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title cleaning liquid nozzle
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