Apparatus and Method for treating substrate

The present invention provides a substrate processing device, which includes: a housing having an internal space; a support unit supporting a substrate in the internal space; a liquid supply unit applying a processing liquid to the substrate placed on the support unit; and an inspection unit measuri...

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Hauptverfasser: LEE SUNG GYU, BAEK HYE BIN, LEE JUNG HYUN, JO YOUNG JU, PARK SEO JUNG, LEE DAE MYEONG
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Sprache:eng ; kor
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creator LEE SUNG GYU
BAEK HYE BIN
LEE JUNG HYUN
JO YOUNG JU
PARK SEO JUNG
LEE DAE MYEONG
description The present invention provides a substrate processing device, which includes: a housing having an internal space; a support unit supporting a substrate in the internal space; a liquid supply unit applying a processing liquid to the substrate placed on the support unit; and an inspection unit measuring the level difference of the liquid applied to the substrate. According to the present invention, the substrate can be inspected without moving the substrate to another facility, thereby shortening the process time. 본 발명은, 내부 공간을 가지는 하우징과 내부 공간에서 기판을 지지하는 지지 유닛과 지지 유닛에 놓인 기판 상에 처리액을 도포하는 액 공급 유닛과 기판 상에 도포된 액의 단차를 측정하는 검사 유닛을 제공하는 것을 목적으로 한다. 상기와 같은 본 발명에 따르면, 기판을 타 설비로 이동하지 않고 기판을 검사할 수 있어 공정 시간을 단축할 수 있는 효과가 있다.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title Apparatus and Method for treating substrate
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