알킬메틸실록산 액체 침지 냉각 매체
공정은 장치를 냉각 유체 중에 침지시키는 단계를 포함하며, 냉각 유체는 다음의 평균 화학 구조 (I): (CH3)3SiO-[(CH3)2)SiO]m-[R(CH3)SiO]n-Si(CH3)3 (I)을 갖는 알킬 개질 실리콘 오일을 포함하고, 상기 식에서, R은 각각의 경우에 6개 이상 그리고 동시에 17개 이하의 탄소 원자를 갖는 알킬 및 치환된 알킬이고; 아래첨자 m은 1 이상 그리고 동시에 22 미만의 값을 갖고, 아래첨자 n은 1 이상의 값을 갖고, m+n의 합은 5 초과 그리고 동시에 50 미만이다. A process includ...
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| creator | ANSEMS BANCROFT PATRICIA LIU ZHIHUA PHAN SON CHEN HONGYU TANG ZHENGMING BHIDE SHREYAS WEI PENG |
| description | 공정은 장치를 냉각 유체 중에 침지시키는 단계를 포함하며, 냉각 유체는 다음의 평균 화학 구조 (I): (CH3)3SiO-[(CH3)2)SiO]m-[R(CH3)SiO]n-Si(CH3)3 (I)을 갖는 알킬 개질 실리콘 오일을 포함하고, 상기 식에서, R은 각각의 경우에 6개 이상 그리고 동시에 17개 이하의 탄소 원자를 갖는 알킬 및 치환된 알킬이고; 아래첨자 m은 1 이상 그리고 동시에 22 미만의 값을 갖고, 아래첨자 n은 1 이상의 값을 갖고, m+n의 합은 5 초과 그리고 동시에 50 미만이다.
A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50. |
| format | Patent |
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A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50.</description><language>kor</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230627&DB=EPODOC&CC=KR&NR=20230093455A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230627&DB=EPODOC&CC=KR&NR=20230093455A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ANSEMS BANCROFT PATRICIA</creatorcontrib><creatorcontrib>LIU ZHIHUA</creatorcontrib><creatorcontrib>PHAN SON</creatorcontrib><creatorcontrib>CHEN HONGYU</creatorcontrib><creatorcontrib>TANG ZHENGMING</creatorcontrib><creatorcontrib>BHIDE SHREYAS</creatorcontrib><creatorcontrib>WEI PENG</creatorcontrib><title>알킬메틸실록산 액체 침지 냉각 매체</title><description>공정은 장치를 냉각 유체 중에 침지시키는 단계를 포함하며, 냉각 유체는 다음의 평균 화학 구조 (I): (CH3)3SiO-[(CH3)2)SiO]m-[R(CH3)SiO]n-Si(CH3)3 (I)을 갖는 알킬 개질 실리콘 오일을 포함하고, 상기 식에서, R은 각각의 경우에 6개 이상 그리고 동시에 17개 이하의 탄소 원자를 갖는 알킬 및 치환된 알킬이고; 아래첨자 m은 1 이상 그리고 동시에 22 미만의 값을 갖고, 아래첨자 n은 1 이상의 값을 갖고, m+n의 합은 5 초과 그리고 동시에 50 미만이다.
A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50.</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB8M7XnbdOa1yunvO3e8aZ7yeuFc980bVB4M3Xhm01bFN7sXPFmeYPC6-bOVxsaFV4vXwIU5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGxgYGlsYmpqaOxsSpAgDV7TrG</recordid><startdate>20230627</startdate><enddate>20230627</enddate><creator>ANSEMS BANCROFT PATRICIA</creator><creator>LIU ZHIHUA</creator><creator>PHAN SON</creator><creator>CHEN HONGYU</creator><creator>TANG ZHENGMING</creator><creator>BHIDE SHREYAS</creator><creator>WEI PENG</creator><scope>EVB</scope></search><sort><creationdate>20230627</creationdate><title>알킬메틸실록산 액체 침지 냉각 매체</title><author>ANSEMS BANCROFT PATRICIA ; LIU ZHIHUA ; PHAN SON ; CHEN HONGYU ; TANG ZHENGMING ; BHIDE SHREYAS ; WEI PENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230093455A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>ANSEMS BANCROFT PATRICIA</creatorcontrib><creatorcontrib>LIU ZHIHUA</creatorcontrib><creatorcontrib>PHAN SON</creatorcontrib><creatorcontrib>CHEN HONGYU</creatorcontrib><creatorcontrib>TANG ZHENGMING</creatorcontrib><creatorcontrib>BHIDE SHREYAS</creatorcontrib><creatorcontrib>WEI PENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ANSEMS BANCROFT PATRICIA</au><au>LIU ZHIHUA</au><au>PHAN SON</au><au>CHEN HONGYU</au><au>TANG ZHENGMING</au><au>BHIDE SHREYAS</au><au>WEI PENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>알킬메틸실록산 액체 침지 냉각 매체</title><date>2023-06-27</date><risdate>2023</risdate><abstract>공정은 장치를 냉각 유체 중에 침지시키는 단계를 포함하며, 냉각 유체는 다음의 평균 화학 구조 (I): (CH3)3SiO-[(CH3)2)SiO]m-[R(CH3)SiO]n-Si(CH3)3 (I)을 갖는 알킬 개질 실리콘 오일을 포함하고, 상기 식에서, R은 각각의 경우에 6개 이상 그리고 동시에 17개 이하의 탄소 원자를 갖는 알킬 및 치환된 알킬이고; 아래첨자 m은 1 이상 그리고 동시에 22 미만의 값을 갖고, 아래첨자 n은 1 이상의 값을 갖고, m+n의 합은 5 초과 그리고 동시에 50 미만이다.
A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | 알킬메틸실록산 액체 침지 냉각 매체 |
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