Low dielectric high heat dissipation film composition for flexible printed circuit board using powder mixing method and manufacturing method thereof

Proposed are a low dielectric high heat dissipation composition for a flexible printed circuit board and a manufacturing method thereof, from which a low dielectric high heat dissipation film for a flexible printed circuit board having excellent performance including low dielectric properties and im...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOO MYONG JAE, JEON YEONG MU, YANG HYUN SEUNG, LEE CHURL SEUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!