Low dielectric high heat dissipation film composition for flexible printed circuit board using powder mixing method and manufacturing method thereof

Proposed are a low dielectric high heat dissipation composition for a flexible printed circuit board and a manufacturing method thereof, from which a low dielectric high heat dissipation film for a flexible printed circuit board having excellent performance including low dielectric properties and im...

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Bibliographische Detailangaben
Hauptverfasser:	YOO MYONG JAE, JEON YEONG MU, YANG HYUN SEUNG, LEE CHURL SEUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Proposed are a low dielectric high heat dissipation composition for a flexible printed circuit board and a manufacturing method thereof, from which a low dielectric high heat dissipation film for a flexible printed circuit board having excellent performance including low dielectric properties and improved heat dissipation characteristics can be obtained. The low dielectric high heat dissipation film composition for a flexible printed circuit board according to the present invention includes a liquid crystal polymer; and a boron nitride-based inorganic filler which wraps the liquid crystal polymer. 저유전특성 및 향상된 방열특성을 갖는 우수한 성능의 연성인쇄회로기판용 저유전 고방열 필름을 얻을 수 있는 연성인쇄회로기판용 저유전 고방열 필름 조성물 및 그의 제조방법이 제안된다. 본 발명에 따른 연성인쇄회로기판용 저유전 고방열 조성물은 액정 고분자; 및 액정 고분자를 래핑하는 질화붕소계 무기필러;를 포함한다.