Heater and substrate processing apparatus having the same

The present invention relates to a heater and a substrate processing apparatus including the same and, more specifically, to a heater and a substrate processing apparatus including the same for performing substrate processing, such as heat treatment. The heater (100) of the present invention compris...

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Hauptverfasser: JANG HEE SUP, PARK JUN YUNG
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PARK JUN YUNG
description The present invention relates to a heater and a substrate processing apparatus including the same and, more specifically, to a heater and a substrate processing apparatus including the same for performing substrate processing, such as heat treatment. The heater (100) of the present invention comprises: an inner tube (110) which has a pre-set length; a heating coil unit (124) which is inserted in a longitudinal direction of the inner tube (110), and is installed in a heating area (BA) set in the inner tube (110); a pair of terminal units (150) which are connected to an external connection terminal (160) to supply power to the heating coil unit (124); and a conical coil unit (123) which has one end coupled to at least one end of both ends of the heating coil unit (124), has the other end coupled to the terminal unit (150), and has a decreasing external diameter. Accordingly, the present invention can perform uniform substrate processing for a substrate by minimizing deformation according to thermal expansion of the heating coil and uniformly maintaining a heat treatment condition. 본 발명은 히터 및 이를 포함하는 기판처리장치에 관한 것으로서, 보다 상세하게는 열처리 등의 기판처리를 수행하기 위한 히터 및 이를 포함하는 기판처리장치에 관한 것이다. 본 발명은, 미리 설정된 길이를 가지는 이너튜브(110)와; 상기 이너튜브(110)의 길이방향으로 삽입되어 상기 이너튜브(110)에 설정된 발열영역(BA)에 설치된 발열코일부(124)와; 외부연결단자(160)와 연결되어 상기 발열코일부(124)로 전원을 공급하기 위한 한 쌍의 단자부(150)와; 일단이 상기 발열코일부(124)의 양단 중 적어도 일단에 결합되고 타단이 상기 단자부(150)에 결합되며, 외경이 감소되는 원뿔코일부(123)를 포함하는 것을 특징으로 하는 히터(100)를 개시한다.
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The heater (100) of the present invention comprises: an inner tube (110) which has a pre-set length; a heating coil unit (124) which is inserted in a longitudinal direction of the inner tube (110), and is installed in a heating area (BA) set in the inner tube (110); a pair of terminal units (150) which are connected to an external connection terminal (160) to supply power to the heating coil unit (124); and a conical coil unit (123) which has one end coupled to at least one end of both ends of the heating coil unit (124), has the other end coupled to the terminal unit (150), and has a decreasing external diameter. Accordingly, the present invention can perform uniform substrate processing for a substrate by minimizing deformation according to thermal expansion of the heating coil and uniformly maintaining a heat treatment condition. 본 발명은 히터 및 이를 포함하는 기판처리장치에 관한 것으로서, 보다 상세하게는 열처리 등의 기판처리를 수행하기 위한 히터 및 이를 포함하는 기판처리장치에 관한 것이다. 본 발명은, 미리 설정된 길이를 가지는 이너튜브(110)와; 상기 이너튜브(110)의 길이방향으로 삽입되어 상기 이너튜브(110)에 설정된 발열영역(BA)에 설치된 발열코일부(124)와; 외부연결단자(160)와 연결되어 상기 발열코일부(124)로 전원을 공급하기 위한 한 쌍의 단자부(150)와; 일단이 상기 발열코일부(124)의 양단 중 적어도 일단에 결합되고 타단이 상기 단자부(150)에 결합되며, 외경이 감소되는 원뿔코일부(123)를 포함하는 것을 특징으로 하는 히터(100)를 개시한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230523&amp;DB=EPODOC&amp;CC=KR&amp;NR=20230071433A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230523&amp;DB=EPODOC&amp;CC=KR&amp;NR=20230071433A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANG HEE SUP</creatorcontrib><creatorcontrib>PARK JUN YUNG</creatorcontrib><title>Heater and substrate processing apparatus having the same</title><description>The present invention relates to a heater and a substrate processing apparatus including the same and, more specifically, to a heater and a substrate processing apparatus including the same for performing substrate processing, such as heat treatment. 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The heater (100) of the present invention comprises: an inner tube (110) which has a pre-set length; a heating coil unit (124) which is inserted in a longitudinal direction of the inner tube (110), and is installed in a heating area (BA) set in the inner tube (110); a pair of terminal units (150) which are connected to an external connection terminal (160) to supply power to the heating coil unit (124); and a conical coil unit (123) which has one end coupled to at least one end of both ends of the heating coil unit (124), has the other end coupled to the terminal unit (150), and has a decreasing external diameter. Accordingly, the present invention can perform uniform substrate processing for a substrate by minimizing deformation according to thermal expansion of the heating coil and uniformly maintaining a heat treatment condition. 본 발명은 히터 및 이를 포함하는 기판처리장치에 관한 것으로서, 보다 상세하게는 열처리 등의 기판처리를 수행하기 위한 히터 및 이를 포함하는 기판처리장치에 관한 것이다. 본 발명은, 미리 설정된 길이를 가지는 이너튜브(110)와; 상기 이너튜브(110)의 길이방향으로 삽입되어 상기 이너튜브(110)에 설정된 발열영역(BA)에 설치된 발열코일부(124)와; 외부연결단자(160)와 연결되어 상기 발열코일부(124)로 전원을 공급하기 위한 한 쌍의 단자부(150)와; 일단이 상기 발열코일부(124)의 양단 중 적어도 일단에 결합되고 타단이 상기 단자부(150)에 결합되며, 외경이 감소되는 원뿔코일부(123)를 포함하는 것을 특징으로 하는 히터(100)를 개시한다.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Heater and substrate processing apparatus having the same
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