SUBSTRATE PROCESSING APPARATUS
A substrate processing device is disclosed. The substrate processing device comprises: a chamber having a processing space where a liquid processing process for a substrate is performed; a support unit that supports the substrate and is provided to be rotatable; and a processing liquid supply unit t...
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| creator | JANG EUN WOO PARK IN HWANG PARK SHI HYUN NA SEUNG EUN |
| description | A substrate processing device is disclosed. The substrate processing device comprises: a chamber having a processing space where a liquid processing process for a substrate is performed; a support unit that supports the substrate and is provided to be rotatable; and a processing liquid supply unit that supplies a processing liquid to the substrate. The chamber comprises: a first side having a gate door through which the substrate enters and exits; a second side provided to face the first side and having a front door provided for a maintenance work of the processing space; and an inner door provided between the second side and the first side to reduce a volume of the processing space.
기판 처리 장치가 개시된다. 기판 처리 장치는 기판에 대한 액처리 공정이 이루어지는 처리 공간을 갖는 챔버; 기판을 지지하며 회전 가능하게 제공되는 지지 유닛; 처리액을 상기 기판에 공급하는 처리액 공급 유닛을 포함하되; 상기 챔버는 기판이 출입하는 게이트 도어를 갖는 제1측면; 상기 제1측면과 대향되게 제공되고 상기 처리 공간의 유지보수 작업을 위해 제공되는 전면 도어를 갖는 제2측면 그리고 상기 제2측면과 상기 제1측면 사이에 제공되어 상기 처리 공간의 체적을 줄여주는 이너 도어를 포함할 수 있다. |
| format | Patent |
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기판 처리 장치가 개시된다. 기판 처리 장치는 기판에 대한 액처리 공정이 이루어지는 처리 공간을 갖는 챔버; 기판을 지지하며 회전 가능하게 제공되는 지지 유닛; 처리액을 상기 기판에 공급하는 처리액 공급 유닛을 포함하되; 상기 챔버는 기판이 출입하는 게이트 도어를 갖는 제1측면; 상기 제1측면과 대향되게 제공되고 상기 처리 공간의 유지보수 작업을 위해 제공되는 전면 도어를 갖는 제2측면 그리고 상기 제2측면과 상기 제1측면 사이에 제공되어 상기 처리 공간의 체적을 줄여주는 이너 도어를 포함할 수 있다.</description><language>eng ; kor</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230517&DB=EPODOC&CC=KR&NR=20230068176A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230517&DB=EPODOC&CC=KR&NR=20230068176A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANG EUN WOO</creatorcontrib><creatorcontrib>PARK IN HWANG</creatorcontrib><creatorcontrib>PARK SHI HYUN</creatorcontrib><creatorcontrib>NA SEUNG EUN</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS</title><description>A substrate processing device is disclosed. The substrate processing device comprises: a chamber having a processing space where a liquid processing process for a substrate is performed; a support unit that supports the substrate and is provided to be rotatable; and a processing liquid supply unit that supplies a processing liquid to the substrate. The chamber comprises: a first side having a gate door through which the substrate enters and exits; a second side provided to face the first side and having a front door provided for a maintenance work of the processing space; and an inner door provided between the second side and the first side to reduce a volume of the processing space.
기판 처리 장치가 개시된다. 기판 처리 장치는 기판에 대한 액처리 공정이 이루어지는 처리 공간을 갖는 챔버; 기판을 지지하며 회전 가능하게 제공되는 지지 유닛; 처리액을 상기 기판에 공급하는 처리액 공급 유닛을 포함하되; 상기 챔버는 기판이 출입하는 게이트 도어를 갖는 제1측면; 상기 제1측면과 대향되게 제공되고 상기 처리 공간의 유지보수 작업을 위해 제공되는 전면 도어를 갖는 제2측면 그리고 상기 제2측면과 상기 제1측면 사이에 제공되어 상기 처리 공간의 체적을 줄여주는 이너 도어를 포함할 수 있다.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDI2MDAzMLQ3MzR2PiVAEAXNgikg</recordid><startdate>20230517</startdate><enddate>20230517</enddate><creator>JANG EUN WOO</creator><creator>PARK IN HWANG</creator><creator>PARK SHI HYUN</creator><creator>NA SEUNG EUN</creator><scope>EVB</scope></search><sort><creationdate>20230517</creationdate><title>SUBSTRATE PROCESSING APPARATUS</title><author>JANG EUN WOO ; PARK IN HWANG ; PARK SHI HYUN ; NA SEUNG EUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230068176A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JANG EUN WOO</creatorcontrib><creatorcontrib>PARK IN HWANG</creatorcontrib><creatorcontrib>PARK SHI HYUN</creatorcontrib><creatorcontrib>NA SEUNG EUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JANG EUN WOO</au><au>PARK IN HWANG</au><au>PARK SHI HYUN</au><au>NA SEUNG EUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS</title><date>2023-05-17</date><risdate>2023</risdate><abstract>A substrate processing device is disclosed. The substrate processing device comprises: a chamber having a processing space where a liquid processing process for a substrate is performed; a support unit that supports the substrate and is provided to be rotatable; and a processing liquid supply unit that supplies a processing liquid to the substrate. The chamber comprises: a first side having a gate door through which the substrate enters and exits; a second side provided to face the first side and having a front door provided for a maintenance work of the processing space; and an inner door provided between the second side and the first side to reduce a volume of the processing space.
기판 처리 장치가 개시된다. 기판 처리 장치는 기판에 대한 액처리 공정이 이루어지는 처리 공간을 갖는 챔버; 기판을 지지하며 회전 가능하게 제공되는 지지 유닛; 처리액을 상기 기판에 공급하는 처리액 공급 유닛을 포함하되; 상기 챔버는 기판이 출입하는 게이트 도어를 갖는 제1측면; 상기 제1측면과 대향되게 제공되고 상기 처리 공간의 유지보수 작업을 위해 제공되는 전면 도어를 갖는 제2측면 그리고 상기 제2측면과 상기 제1측면 사이에 제공되어 상기 처리 공간의 체적을 줄여주는 이너 도어를 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | SUBSTRATE PROCESSING APPARATUS |
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