EPOXY RESIN PREPARING METHOD THEREOF EPOXY COMPOSITION COMPRISING THE SAME AND THS USE THEREOF

The present invention relates to an epoxy resin with a controlled molecular weight distribution having a molecular weight distribution range of 300 to 2,000,000, wherein the upper limit of the molecular weight is increased up to 2,000,000, a preparing method thereof, a composition comprising the sam...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM YUN JU, PARK SU JIN, PARK SOOK YEON, CHUN HYUN AEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to an epoxy resin with a controlled molecular weight distribution having a molecular weight distribution range of 300 to 2,000,000, wherein the upper limit of the molecular weight is increased up to 2,000,000, a preparing method thereof, a composition comprising the same, and the use thereof. The epoxy resin with the controlled molecular weight distribution of the present invention has improved thermal properties of the epoxy system and exhibits excellent processability due to the expanded molecular weight distribution. 본 발명은 분자량의 상한값이 최대 2,000,000까지 증가된 것으로, 300 내지 2,000,000의 분자량 분포 범위를 갖는 분자량 분포가 조절된 에폭시 수지, 이의 제조방법, 이를 포함하는 조성물 및 용도에 관한 것이다. 본 발명의 분자량 분포가 조절된 에폭시 수지는 분자량 분포의 확대에 의해 에폭시 시스템의 열적 특성이 향상되고, 우수한 공정성을 나타낸다.