LASER BONDING SYSTEM AND CONTROL METHOD THEREFOR
The laser bonding system of the present invention bonds a device by emitting a laser. The system includes a window, a laser emitting device, and a plurality of pressing modules disposed on the upper surface of the window. Each of the pressing modules includes an actuator that presses a different poi...
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| creator | NAM GI JUNG LEE GUNNER KANG SEONG MIN CHO CHEOL JOO JUNG EUI GUK |
| description | The laser bonding system of the present invention bonds a device by emitting a laser. The system includes a window, a laser emitting device, and a plurality of pressing modules disposed on the upper surface of the window. Each of the pressing modules includes an actuator that presses a different point of the upper surface of the window downward. Bonding quality can be improved by correcting the distortion and height difference of the device being bonded through the plurality of pressing modules.
본 발명의 레이저 본딩 시스템은 디바이스에 레이저를 조사하여 본딩하는 것으로, 윈도우, 레이저 조사 장치 및 상기 윈도우의 상면에 배치되는 복수의 가압모듈을 포함한다. 복수의 가압모듈은, 윈도우의 상면 중 서로 다른 일 지점을 하부로 가압하는 액추에이터를 각각 포함한다. 이와 같은 복수의 가압 모듈을 통해 본딩되는 디바이스의 틀어짐 및 높이 차를 보정하여 본딩 품질을 향상할 수 있다. |
| format | Patent |
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본 발명의 레이저 본딩 시스템은 디바이스에 레이저를 조사하여 본딩하는 것으로, 윈도우, 레이저 조사 장치 및 상기 윈도우의 상면에 배치되는 복수의 가압모듈을 포함한다. 복수의 가압모듈은, 윈도우의 상면 중 서로 다른 일 지점을 하부로 가압하는 액추에이터를 각각 포함한다. 이와 같은 복수의 가압 모듈을 통해 본딩되는 디바이스의 틀어짐 및 높이 차를 보정하여 본딩 품질을 향상할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwcQx2DVJw8vdz8fRzVwiODA5x9VVw9HNRcPb3Cwny91HwdQ3x8HdRCPFwDXJ18w_iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkbGBgZmRpbGho7GxKkCAMLlJxw</recordid><startdate>20230509</startdate><enddate>20230509</enddate><creator>NAM GI JUNG</creator><creator>LEE GUNNER</creator><creator>KANG SEONG MIN</creator><creator>CHO CHEOL JOO</creator><creator>JUNG EUI GUK</creator><scope>EVB</scope></search><sort><creationdate>20230509</creationdate><title>LASER BONDING SYSTEM AND CONTROL METHOD THEREFOR</title><author>NAM GI JUNG ; LEE GUNNER ; KANG SEONG MIN ; CHO CHEOL JOO ; JUNG EUI GUK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230062931A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>NAM GI JUNG</creatorcontrib><creatorcontrib>LEE GUNNER</creatorcontrib><creatorcontrib>KANG SEONG MIN</creatorcontrib><creatorcontrib>CHO CHEOL JOO</creatorcontrib><creatorcontrib>JUNG EUI GUK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAM GI JUNG</au><au>LEE GUNNER</au><au>KANG SEONG MIN</au><au>CHO CHEOL JOO</au><au>JUNG EUI GUK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER BONDING SYSTEM AND CONTROL METHOD THEREFOR</title><date>2023-05-09</date><risdate>2023</risdate><abstract>The laser bonding system of the present invention bonds a device by emitting a laser. The system includes a window, a laser emitting device, and a plurality of pressing modules disposed on the upper surface of the window. Each of the pressing modules includes an actuator that presses a different point of the upper surface of the window downward. Bonding quality can be improved by correcting the distortion and height difference of the device being bonded through the plurality of pressing modules.
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER BONDING SYSTEM AND CONTROL METHOD THEREFOR |
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