Polishing apparatus for substrate polishing system for substrate including the same and polishing method for substrate using the same
Provided is a substrate polishing apparatus. The substrate polishing apparatus of the present invention comprises: an electric field application module; and a platen which rotates a polishing pad. The electric field application module includes an interior electrode having a circular shape in a plan...
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| creator | LEE JAEHYUG LEE SEUNGJUN KIM, CHAE LYOUNG KIM HOYOUNG |
| description | Provided is a substrate polishing apparatus. The substrate polishing apparatus of the present invention comprises: an electric field application module; and a platen which rotates a polishing pad. The electric field application module includes an interior electrode having a circular shape in a plan view. The platen is located on the interior electrode, and a central axis of the interior electrode is spaced apart from a central axis of the platen. The interior electrode includes: a first electrode; and an annular second electrode surrounding the first electrode. Provided is the substrate polishing apparatus, capable of controlling an electric field for each region, a substrate polishing system including the same, and a substrate polishing method using the same.
전기장 인가 모듈; 및 연마 패드를 회전시키는 플레이튼; 을 포함하고, 상기 전기장 인가 모듈은 평면적 관점에서 원형 형상을 갖는 내부 전극을 포함하며, 상기 플레이튼은 상기 내부 전극 상에 위치하되, 상기 내부 전극의 중심 축은 상기 플레이튼의 중심 축으로부터 이격되고, 상기 내부 전극은: 제1 전극; 및 상기 제1 전극을 감싸는 환형(annular)의 제2 전극; 을 포함하는 기판 연마 장치가 제공된다. |
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전기장 인가 모듈; 및 연마 패드를 회전시키는 플레이튼; 을 포함하고, 상기 전기장 인가 모듈은 평면적 관점에서 원형 형상을 갖는 내부 전극을 포함하며, 상기 플레이튼은 상기 내부 전극 상에 위치하되, 상기 내부 전극의 중심 축은 상기 플레이튼의 중심 축으로부터 이격되고, 상기 내부 전극은: 제1 전극; 및 상기 제1 전극을 감싸는 환형(annular)의 제2 전극; 을 포함하는 기판 연마 장치가 제공된다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230503&DB=EPODOC&CC=KR&NR=20230058251A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230503&DB=EPODOC&CC=KR&NR=20230058251A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE JAEHYUG</creatorcontrib><creatorcontrib>LEE SEUNGJUN</creatorcontrib><creatorcontrib>KIM, CHAE LYOUNG</creatorcontrib><creatorcontrib>KIM HOYOUNG</creatorcontrib><title>Polishing apparatus for substrate polishing system for substrate including the same and polishing method for substrate using the same</title><description>Provided is a substrate polishing apparatus. The substrate polishing apparatus of the present invention comprises: an electric field application module; and a platen which rotates a polishing pad. The electric field application module includes an interior electrode having a circular shape in a plan view. The platen is located on the interior electrode, and a central axis of the interior electrode is spaced apart from a central axis of the platen. The interior electrode includes: a first electrode; and an annular second electrode surrounding the first electrode. Provided is the substrate polishing apparatus, capable of controlling an electric field for each region, a substrate polishing system including the same, and a substrate polishing method using the same.
전기장 인가 모듈; 및 연마 패드를 회전시키는 플레이튼; 을 포함하고, 상기 전기장 인가 모듈은 평면적 관점에서 원형 형상을 갖는 내부 전극을 포함하며, 상기 플레이튼은 상기 내부 전극 상에 위치하되, 상기 내부 전극의 중심 축은 상기 플레이튼의 중심 축으로부터 이격되고, 상기 내부 전극은: 제1 전극; 및 상기 제1 전극을 감싸는 환형(annular)의 제2 전극; 을 포함하는 기판 연마 장치가 제공된다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGgNyM_JLM7IzEtXSCwoSCxKLCktVkjLL1IoLk0qLgFyUxUK4CqKK4tLUnPRpDPzknNKU0DSJRmpCsWJuakKiXkpSLpyU0sy8lPQdJUWI-vgYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkbGBgamFkamho7GxKkCANLDTQ4</recordid><startdate>20230503</startdate><enddate>20230503</enddate><creator>LEE JAEHYUG</creator><creator>LEE SEUNGJUN</creator><creator>KIM, CHAE LYOUNG</creator><creator>KIM HOYOUNG</creator><scope>EVB</scope></search><sort><creationdate>20230503</creationdate><title>Polishing apparatus for substrate polishing system for substrate including the same and polishing method for substrate using the same</title><author>LEE JAEHYUG ; LEE SEUNGJUN ; KIM, CHAE LYOUNG ; KIM HOYOUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230058251A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE JAEHYUG</creatorcontrib><creatorcontrib>LEE SEUNGJUN</creatorcontrib><creatorcontrib>KIM, CHAE LYOUNG</creatorcontrib><creatorcontrib>KIM HOYOUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE JAEHYUG</au><au>LEE SEUNGJUN</au><au>KIM, CHAE LYOUNG</au><au>KIM HOYOUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing apparatus for substrate polishing system for substrate including the same and polishing method for substrate using the same</title><date>2023-05-03</date><risdate>2023</risdate><abstract>Provided is a substrate polishing apparatus. The substrate polishing apparatus of the present invention comprises: an electric field application module; and a platen which rotates a polishing pad. The electric field application module includes an interior electrode having a circular shape in a plan view. The platen is located on the interior electrode, and a central axis of the interior electrode is spaced apart from a central axis of the platen. The interior electrode includes: a first electrode; and an annular second electrode surrounding the first electrode. Provided is the substrate polishing apparatus, capable of controlling an electric field for each region, a substrate polishing system including the same, and a substrate polishing method using the same.
전기장 인가 모듈; 및 연마 패드를 회전시키는 플레이튼; 을 포함하고, 상기 전기장 인가 모듈은 평면적 관점에서 원형 형상을 갖는 내부 전극을 포함하며, 상기 플레이튼은 상기 내부 전극 상에 위치하되, 상기 내부 전극의 중심 축은 상기 플레이튼의 중심 축으로부터 이격되고, 상기 내부 전극은: 제1 전극; 및 상기 제1 전극을 감싸는 환형(annular)의 제2 전극; 을 포함하는 기판 연마 장치가 제공된다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Polishing apparatus for substrate polishing system for substrate including the same and polishing method for substrate using the same |
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