폴리아미드이미드를 포함하는 와이어 에나멜 조성물
본 발명은 와이어용 일차 절연재로서 사용하기에 매우 적합한 폴리아미드이미드 조성물에 관한 것이다. 조성물은 55 내지 65 pbw의 N-n-부틸 피롤리돈, 25 내지 40 pbw의 폴리아미드이미드 수지, 0 내지 20 pbw의 다른 성분을 포함하며, 여기서 폴리아미드이미드 수지는 10000 내지 40000 g/mol(달톤)의 Mw 및 1.1 내지 2의 Mw/Mn 비를 갖는다. The present invention relates to a polyamideimide composition that is highly suitable fo...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | BIONDI GIOVANNA CECI ANDREA LOGGI GIOVANNI |
| description | 본 발명은 와이어용 일차 절연재로서 사용하기에 매우 적합한 폴리아미드이미드 조성물에 관한 것이다. 조성물은 55 내지 65 pbw의 N-n-부틸 피롤리돈, 25 내지 40 pbw의 폴리아미드이미드 수지, 0 내지 20 pbw의 다른 성분을 포함하며, 여기서 폴리아미드이미드 수지는 10000 내지 40000 g/mol(달톤)의 Mw 및 1.1 내지 2의 Mw/Mn 비를 갖는다.
The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20230052939A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20230052939A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20230052939A3</originalsourceid><addsrcrecordid>eNrjZHB727_l9bI1b6a2vF6_4_XkOW_mboEwXi_do_C2f83bqSveTp3xumuKwpuZDUDJN9O2KLyZPuF104zXK-covFm44U3Lxtdr9vAwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDI2MDA1MjS2NLR2PiVAEA_pFKSA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>폴리아미드이미드를 포함하는 와이어 에나멜 조성물</title><source>esp@cenet</source><creator>BIONDI GIOVANNA ; CECI ANDREA ; LOGGI GIOVANNI</creator><creatorcontrib>BIONDI GIOVANNA ; CECI ANDREA ; LOGGI GIOVANNI</creatorcontrib><description>본 발명은 와이어용 일차 절연재로서 사용하기에 매우 적합한 폴리아미드이미드 조성물에 관한 것이다. 조성물은 55 내지 65 pbw의 N-n-부틸 피롤리돈, 25 내지 40 pbw의 폴리아미드이미드 수지, 0 내지 20 pbw의 다른 성분을 포함하며, 여기서 폴리아미드이미드 수지는 10000 내지 40000 g/mol(달톤)의 Mw 및 1.1 내지 2의 Mw/Mn 비를 갖는다.
The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.</description><language>kor</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230420&DB=EPODOC&CC=KR&NR=20230052939A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230420&DB=EPODOC&CC=KR&NR=20230052939A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BIONDI GIOVANNA</creatorcontrib><creatorcontrib>CECI ANDREA</creatorcontrib><creatorcontrib>LOGGI GIOVANNI</creatorcontrib><title>폴리아미드이미드를 포함하는 와이어 에나멜 조성물</title><description>본 발명은 와이어용 일차 절연재로서 사용하기에 매우 적합한 폴리아미드이미드 조성물에 관한 것이다. 조성물은 55 내지 65 pbw의 N-n-부틸 피롤리돈, 25 내지 40 pbw의 폴리아미드이미드 수지, 0 내지 20 pbw의 다른 성분을 포함하며, 여기서 폴리아미드이미드 수지는 10000 내지 40000 g/mol(달톤)의 Mw 및 1.1 내지 2의 Mw/Mn 비를 갖는다.
The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB727_l9bI1b6a2vF6_4_XkOW_mboEwXi_do_C2f83bqSveTp3xumuKwpuZDUDJN9O2KLyZPuF104zXK-covFm44U3Lxtdr9vAwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDI2MDA1MjS2NLR2PiVAEA_pFKSA</recordid><startdate>20230420</startdate><enddate>20230420</enddate><creator>BIONDI GIOVANNA</creator><creator>CECI ANDREA</creator><creator>LOGGI GIOVANNI</creator><scope>EVB</scope></search><sort><creationdate>20230420</creationdate><title>폴리아미드이미드를 포함하는 와이어 에나멜 조성물</title><author>BIONDI GIOVANNA ; CECI ANDREA ; LOGGI GIOVANNI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230052939A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>BIONDI GIOVANNA</creatorcontrib><creatorcontrib>CECI ANDREA</creatorcontrib><creatorcontrib>LOGGI GIOVANNI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BIONDI GIOVANNA</au><au>CECI ANDREA</au><au>LOGGI GIOVANNI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>폴리아미드이미드를 포함하는 와이어 에나멜 조성물</title><date>2023-04-20</date><risdate>2023</risdate><abstract>본 발명은 와이어용 일차 절연재로서 사용하기에 매우 적합한 폴리아미드이미드 조성물에 관한 것이다. 조성물은 55 내지 65 pbw의 N-n-부틸 피롤리돈, 25 내지 40 pbw의 폴리아미드이미드 수지, 0 내지 20 pbw의 다른 성분을 포함하며, 여기서 폴리아미드이미드 수지는 10000 내지 40000 g/mol(달톤)의 Mw 및 1.1 내지 2의 Mw/Mn 비를 갖는다.
The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | kor |
| recordid | cdi_epo_espacenet_KR20230052939A |
| source | esp@cenet |
| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS |
| title | 폴리아미드이미드를 포함하는 와이어 에나멜 조성물 |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T10%3A20%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BIONDI%20GIOVANNA&rft.date=2023-04-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20230052939A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |