낮은 반사율의 이중 경화 접착제 조성물
경화된 상태일 때 매우 낮은 가시 광선 반사율을 나타내는 이중-경화 접착제 조성물. 접착제는 전자기 방사선 및 실온 또는 그 초과의 온도에 의해 경화가능하다. 매우 낮은 가시 광선 반사율로 인해, 접착제는 특히 가시 광선 투과에 의한 간섭을 최소화해야 하는 광학 제품에 적용가능하다. A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by elect...
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| creator | OUYANG JIANGBO CROSS ROBERT P LIU PUWEI |
| description | 경화된 상태일 때 매우 낮은 가시 광선 반사율을 나타내는 이중-경화 접착제 조성물. 접착제는 전자기 방사선 및 실온 또는 그 초과의 온도에 의해 경화가능하다. 매우 낮은 가시 광선 반사율로 인해, 접착제는 특히 가시 광선 투과에 의한 간섭을 최소화해야 하는 광학 제품에 적용가능하다.
A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible light reflectance, the adhesive is particularly applicable to optical products that demand minimal interference with visible light transmission. |
| format | Patent |
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A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible light reflectance, the adhesive is particularly applicable to optical products that demand minimal interference with visible light transmission.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230404&DB=EPODOC&CC=KR&NR=20230045599A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230404&DB=EPODOC&CC=KR&NR=20230045599A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OUYANG JIANGBO</creatorcontrib><creatorcontrib>CROSS ROBERT P</creatorcontrib><creatorcontrib>LIU PUWEI</creatorcontrib><title>낮은 반사율의 이중 경화 접착제 조성물</title><description>경화된 상태일 때 매우 낮은 가시 광선 반사율을 나타내는 이중-경화 접착제 조성물. 접착제는 전자기 방사선 및 실온 또는 그 초과의 온도에 의해 경화가능하다. 매우 낮은 가시 광선 반사율로 인해, 접착제는 특히 가시 광선 투과에 의한 간섭을 최소화해야 하는 광학 제품에 적용가능하다.
A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible light reflectance, the adhesive is particularly applicable to optical products that demand minimal interference with visible light transmission.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB93bTuzdwGhdcbZrxpWvNmzoo3c2covJm75c2SiQqvNu19O3OKwpsFE99sWPlmwRyFNws3vGnZ-HrNHh4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEu8dZGRgZGxgYGJqamnpaEycKgA7wD10</recordid><startdate>20230404</startdate><enddate>20230404</enddate><creator>OUYANG JIANGBO</creator><creator>CROSS ROBERT P</creator><creator>LIU PUWEI</creator><scope>EVB</scope></search><sort><creationdate>20230404</creationdate><title>낮은 반사율의 이중 경화 접착제 조성물</title><author>OUYANG JIANGBO ; CROSS ROBERT P ; LIU PUWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230045599A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>OUYANG JIANGBO</creatorcontrib><creatorcontrib>CROSS ROBERT P</creatorcontrib><creatorcontrib>LIU PUWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OUYANG JIANGBO</au><au>CROSS ROBERT P</au><au>LIU PUWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>낮은 반사율의 이중 경화 접착제 조성물</title><date>2023-04-04</date><risdate>2023</risdate><abstract>경화된 상태일 때 매우 낮은 가시 광선 반사율을 나타내는 이중-경화 접착제 조성물. 접착제는 전자기 방사선 및 실온 또는 그 초과의 온도에 의해 경화가능하다. 매우 낮은 가시 광선 반사율로 인해, 접착제는 특히 가시 광선 투과에 의한 간섭을 최소화해야 하는 광학 제품에 적용가능하다.
A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible light reflectance, the adhesive is particularly applicable to optical products that demand minimal interference with visible light transmission.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | 낮은 반사율의 이중 경화 접착제 조성물 |
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