CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME
According to one embodiment, a camera module comprises: a printed circuit board including a conductive pad exposed on one surface; an image sensor disposed on the printed circuit board; a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to t...
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| creator | WONCHUL CHO CHONGUK HEO TAEYUN KIM KWANGSIC CHOI MINKI CHO WONJUN JEONG DOHYUN AHN JUNGSOO KIM |
| description | According to one embodiment, a camera module comprises: a printed circuit board including a conductive pad exposed on one surface; an image sensor disposed on the printed circuit board; a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad; an actuator disposed on the image sensor and controlling the position of a lens assembly; and a shield can surrounding the actuator and electrically connected to the conductive plate, wherein the conductive plate may release heat generated from the image sensor to the outside of the camera module by contact with the image sensor. The camera module for heat dissipation and grounding can secure a sufficient ground surface through the conductive plate such that electromagnetic waves generated when the actuator is driven can be effectively shielded.
일 실시예에 따른, 카메라 모듈은, 일 면상에 노출되는 도전성 패드를 포함하는, 인쇄 회로 기판, 상기 인쇄 회로 기판상에 배치되는 이미지 센서, 상기 인쇄 회로 기판과 상기 이미지 센서 사이에 배치되고, 상기 도전성 패드와 전기적으로 연결되는, 도전성 플레이트, 상기 이미지 센서 상에 배치되고, 렌즈 어셈블리의 위치를 조절하는 액추에이터 및 상기 액추에이터를 감싸고, 상기 도전성 플레이트와 전기적으로 연결되는 실드 캔(shield can)을 포함하고, 상기 도전성 플레이트는, 상기 이미지 센서와 접촉에 의해, 상기 이미지 센서로부터 발생되는 열을 상기 카메라 모듈의 외부로 방출(release)할 수 있다. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20230043642A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20230043642A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20230043642A3</originalsourceid><addsrcrecordid>eNqNjLsKwjAUQLM4iPoPF5yFkBT3kNw2F9NE8uhaisRJtFD_Hyv4AU7nDIezZYNWPUYFfTDFIbQhgkWVwVBKdFWZggflDXQxlBVfRYc6x-BJg8GBNAJ57Yoh30G2CGk97tnmPj2Wevhxx44tZm1PdX6NdZmnW33W93iJggvJeSPPjVDyv-oDC30w_Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME</title><source>esp@cenet</source><creator>WONCHUL CHO ; CHONGUK HEO ; TAEYUN KIM ; KWANGSIC CHOI ; MINKI CHO ; WONJUN JEONG ; DOHYUN AHN ; JUNGSOO KIM</creator><creatorcontrib>WONCHUL CHO ; CHONGUK HEO ; TAEYUN KIM ; KWANGSIC CHOI ; MINKI CHO ; WONJUN JEONG ; DOHYUN AHN ; JUNGSOO KIM</creatorcontrib><description>According to one embodiment, a camera module comprises: a printed circuit board including a conductive pad exposed on one surface; an image sensor disposed on the printed circuit board; a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad; an actuator disposed on the image sensor and controlling the position of a lens assembly; and a shield can surrounding the actuator and electrically connected to the conductive plate, wherein the conductive plate may release heat generated from the image sensor to the outside of the camera module by contact with the image sensor. The camera module for heat dissipation and grounding can secure a sufficient ground surface through the conductive plate such that electromagnetic waves generated when the actuator is driven can be effectively shielded.
일 실시예에 따른, 카메라 모듈은, 일 면상에 노출되는 도전성 패드를 포함하는, 인쇄 회로 기판, 상기 인쇄 회로 기판상에 배치되는 이미지 센서, 상기 인쇄 회로 기판과 상기 이미지 센서 사이에 배치되고, 상기 도전성 패드와 전기적으로 연결되는, 도전성 플레이트, 상기 이미지 센서 상에 배치되고, 렌즈 어셈블리의 위치를 조절하는 액추에이터 및 상기 액추에이터를 감싸고, 상기 도전성 플레이트와 전기적으로 연결되는 실드 캔(shield can)을 포함하고, 상기 도전성 플레이트는, 상기 이미지 센서와 접촉에 의해, 상기 이미지 센서로부터 발생되는 열을 상기 카메라 모듈의 외부로 방출(release)할 수 있다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230331&DB=EPODOC&CC=KR&NR=20230043642A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230331&DB=EPODOC&CC=KR&NR=20230043642A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WONCHUL CHO</creatorcontrib><creatorcontrib>CHONGUK HEO</creatorcontrib><creatorcontrib>TAEYUN KIM</creatorcontrib><creatorcontrib>KWANGSIC CHOI</creatorcontrib><creatorcontrib>MINKI CHO</creatorcontrib><creatorcontrib>WONJUN JEONG</creatorcontrib><creatorcontrib>DOHYUN AHN</creatorcontrib><creatorcontrib>JUNGSOO KIM</creatorcontrib><title>CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME</title><description>According to one embodiment, a camera module comprises: a printed circuit board including a conductive pad exposed on one surface; an image sensor disposed on the printed circuit board; a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad; an actuator disposed on the image sensor and controlling the position of a lens assembly; and a shield can surrounding the actuator and electrically connected to the conductive plate, wherein the conductive plate may release heat generated from the image sensor to the outside of the camera module by contact with the image sensor. The camera module for heat dissipation and grounding can secure a sufficient ground surface through the conductive plate such that electromagnetic waves generated when the actuator is driven can be effectively shielded.
일 실시예에 따른, 카메라 모듈은, 일 면상에 노출되는 도전성 패드를 포함하는, 인쇄 회로 기판, 상기 인쇄 회로 기판상에 배치되는 이미지 센서, 상기 인쇄 회로 기판과 상기 이미지 센서 사이에 배치되고, 상기 도전성 패드와 전기적으로 연결되는, 도전성 플레이트, 상기 이미지 센서 상에 배치되고, 렌즈 어셈블리의 위치를 조절하는 액추에이터 및 상기 액추에이터를 감싸고, 상기 도전성 플레이트와 전기적으로 연결되는 실드 캔(shield can)을 포함하고, 상기 도전성 플레이트는, 상기 이미지 센서와 접촉에 의해, 상기 이미지 센서로부터 발생되는 열을 상기 카메라 모듈의 외부로 방출(release)할 수 있다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKwjAUQLM4iPoPF5yFkBT3kNw2F9NE8uhaisRJtFD_Hyv4AU7nDIezZYNWPUYFfTDFIbQhgkWVwVBKdFWZggflDXQxlBVfRYc6x-BJg8GBNAJ57Yoh30G2CGk97tnmPj2Wevhxx44tZm1PdX6NdZmnW33W93iJggvJeSPPjVDyv-oDC30w_Q</recordid><startdate>20230331</startdate><enddate>20230331</enddate><creator>WONCHUL CHO</creator><creator>CHONGUK HEO</creator><creator>TAEYUN KIM</creator><creator>KWANGSIC CHOI</creator><creator>MINKI CHO</creator><creator>WONJUN JEONG</creator><creator>DOHYUN AHN</creator><creator>JUNGSOO KIM</creator><scope>EVB</scope></search><sort><creationdate>20230331</creationdate><title>CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME</title><author>WONCHUL CHO ; CHONGUK HEO ; TAEYUN KIM ; KWANGSIC CHOI ; MINKI CHO ; WONJUN JEONG ; DOHYUN AHN ; JUNGSOO KIM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230043642A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>WONCHUL CHO</creatorcontrib><creatorcontrib>CHONGUK HEO</creatorcontrib><creatorcontrib>TAEYUN KIM</creatorcontrib><creatorcontrib>KWANGSIC CHOI</creatorcontrib><creatorcontrib>MINKI CHO</creatorcontrib><creatorcontrib>WONJUN JEONG</creatorcontrib><creatorcontrib>DOHYUN AHN</creatorcontrib><creatorcontrib>JUNGSOO KIM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WONCHUL CHO</au><au>CHONGUK HEO</au><au>TAEYUN KIM</au><au>KWANGSIC CHOI</au><au>MINKI CHO</au><au>WONJUN JEONG</au><au>DOHYUN AHN</au><au>JUNGSOO KIM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME</title><date>2023-03-31</date><risdate>2023</risdate><abstract>According to one embodiment, a camera module comprises: a printed circuit board including a conductive pad exposed on one surface; an image sensor disposed on the printed circuit board; a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad; an actuator disposed on the image sensor and controlling the position of a lens assembly; and a shield can surrounding the actuator and electrically connected to the conductive plate, wherein the conductive plate may release heat generated from the image sensor to the outside of the camera module by contact with the image sensor. The camera module for heat dissipation and grounding can secure a sufficient ground surface through the conductive plate such that electromagnetic waves generated when the actuator is driven can be effectively shielded.
일 실시예에 따른, 카메라 모듈은, 일 면상에 노출되는 도전성 패드를 포함하는, 인쇄 회로 기판, 상기 인쇄 회로 기판상에 배치되는 이미지 센서, 상기 인쇄 회로 기판과 상기 이미지 센서 사이에 배치되고, 상기 도전성 패드와 전기적으로 연결되는, 도전성 플레이트, 상기 이미지 센서 상에 배치되고, 렌즈 어셈블리의 위치를 조절하는 액추에이터 및 상기 액추에이터를 감싸고, 상기 도전성 플레이트와 전기적으로 연결되는 실드 캔(shield can)을 포함하고, 상기 도전성 플레이트는, 상기 이미지 센서와 접촉에 의해, 상기 이미지 센서로부터 발생되는 열을 상기 카메라 모듈의 외부로 방출(release)할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS |
| title | CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME |
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