PCB SEMI-AQUEOUS CLEANING COMPOSITION FOR PCB
The present invention relates to a printed circuit board (PCB) semi-aqueous cleaning agent composition. More specifically, the present invention relates to a PCB semi-aqueous cleaning agent composition which contains, based on the total weight (wt) of the detergent composition, 0.1 to 5 wt% of a sil...
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| creator | BAE SOO JEONG LEE, HO YEOUL |
| description | The present invention relates to a printed circuit board (PCB) semi-aqueous cleaning agent composition. More specifically, the present invention relates to a PCB semi-aqueous cleaning agent composition which contains, based on the total weight (wt) of the detergent composition, 0.1 to 5 wt% of a silicone surfactant, 10 to 40 wt% of a nitrogen heterocyclic compound, 30 to 70 wt% of an alkyl glycol ether, and the remaining amount of water, so that there is excellent cleaning power against foreign substances such as flux and resin remaining on the board after reflow during the soldering process during the manufacturing of PCB.
본 발명은 PCB 준수계 세정제 조성물에 관한 것으로, 세정제 조성물 총 중량(wt)에 대하여, 실리콘 계면활성제 0.1 내지 5 wt%; 질소 헤테로고리 화합물 10 내지 40 wt%; 알킬 글리콜 에테르 30 내지 70 wt%; 및 물 잔량;을 포함함으로써, 인쇄회로기판(PCB) 제조시 솔더링 공정 중 리플로우 이후 기판 상에 잔류하는 플럭스 및 레진 등의 이물질에 대한 세정력이 뛰어난 PCB 준수계 세정제 조성물에 관한 것이다. |
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본 발명은 PCB 준수계 세정제 조성물에 관한 것으로, 세정제 조성물 총 중량(wt)에 대하여, 실리콘 계면활성제 0.1 내지 5 wt%; 질소 헤테로고리 화합물 10 내지 40 wt%; 알킬 글리콜 에테르 30 내지 70 wt%; 및 물 잔량;을 포함함으로써, 인쇄회로기판(PCB) 제조시 솔더링 공정 중 리플로우 이후 기판 상에 잔류하는 플럭스 및 레진 등의 이물질에 대한 세정력이 뛰어난 PCB 준수계 세정제 조성물에 관한 것이다.</description><language>eng ; kor</language><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES ; CANDLES ; CHEMISTRY ; DETERGENT COMPOSITIONS ; DETERGENTS ; FATTY ACIDS THEREFROM ; METALLURGY ; RECOVERY OF GLYCEROL ; RESIN SOAPS ; SOAP OR SOAP-MAKING ; USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230314&DB=EPODOC&CC=KR&NR=20230036466A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230314&DB=EPODOC&CC=KR&NR=20230036466A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAE SOO JEONG</creatorcontrib><creatorcontrib>LEE, HO YEOUL</creatorcontrib><title>PCB SEMI-AQUEOUS CLEANING COMPOSITION FOR PCB</title><description>The present invention relates to a printed circuit board (PCB) semi-aqueous cleaning agent composition. More specifically, the present invention relates to a PCB semi-aqueous cleaning agent composition which contains, based on the total weight (wt) of the detergent composition, 0.1 to 5 wt% of a silicone surfactant, 10 to 40 wt% of a nitrogen heterocyclic compound, 30 to 70 wt% of an alkyl glycol ether, and the remaining amount of water, so that there is excellent cleaning power against foreign substances such as flux and resin remaining on the board after reflow during the soldering process during the manufacturing of PCB.
본 발명은 PCB 준수계 세정제 조성물에 관한 것으로, 세정제 조성물 총 중량(wt)에 대하여, 실리콘 계면활성제 0.1 내지 5 wt%; 질소 헤테로고리 화합물 10 내지 40 wt%; 알킬 글리콜 에테르 30 내지 70 wt%; 및 물 잔량;을 포함함으로써, 인쇄회로기판(PCB) 제조시 솔더링 공정 중 리플로우 이후 기판 상에 잔류하는 플럭스 및 레진 등의 이물질에 대한 세정력이 뛰어난 PCB 준수계 세정제 조성물에 관한 것이다.</description><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</subject><subject>CANDLES</subject><subject>CHEMISTRY</subject><subject>DETERGENT COMPOSITIONS</subject><subject>DETERGENTS</subject><subject>FATTY ACIDS THEREFROM</subject><subject>METALLURGY</subject><subject>RECOVERY OF GLYCEROL</subject><subject>RESIN SOAPS</subject><subject>SOAP OR SOAP-MAKING</subject><subject>USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANcHZSCHb19dR1DAx19Q8NVnD2cXX08_RzV3D29w3wD_YM8fT3U3DzD1IAquRhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGRsYGBsZmJmZmjsbEqQIARHgmNA</recordid><startdate>20230314</startdate><enddate>20230314</enddate><creator>BAE SOO JEONG</creator><creator>LEE, HO YEOUL</creator><scope>EVB</scope></search><sort><creationdate>20230314</creationdate><title>PCB SEMI-AQUEOUS CLEANING COMPOSITION FOR PCB</title><author>BAE SOO JEONG ; LEE, HO YEOUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230036466A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</topic><topic>CANDLES</topic><topic>CHEMISTRY</topic><topic>DETERGENT COMPOSITIONS</topic><topic>DETERGENTS</topic><topic>FATTY ACIDS THEREFROM</topic><topic>METALLURGY</topic><topic>RECOVERY OF GLYCEROL</topic><topic>RESIN SOAPS</topic><topic>SOAP OR SOAP-MAKING</topic><topic>USE OF SINGLE SUBSTANCES AS DETERGENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>BAE SOO JEONG</creatorcontrib><creatorcontrib>LEE, HO YEOUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAE SOO JEONG</au><au>LEE, HO YEOUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PCB SEMI-AQUEOUS CLEANING COMPOSITION FOR PCB</title><date>2023-03-14</date><risdate>2023</risdate><abstract>The present invention relates to a printed circuit board (PCB) semi-aqueous cleaning agent composition. More specifically, the present invention relates to a PCB semi-aqueous cleaning agent composition which contains, based on the total weight (wt) of the detergent composition, 0.1 to 5 wt% of a silicone surfactant, 10 to 40 wt% of a nitrogen heterocyclic compound, 30 to 70 wt% of an alkyl glycol ether, and the remaining amount of water, so that there is excellent cleaning power against foreign substances such as flux and resin remaining on the board after reflow during the soldering process during the manufacturing of PCB.
본 발명은 PCB 준수계 세정제 조성물에 관한 것으로, 세정제 조성물 총 중량(wt)에 대하여, 실리콘 계면활성제 0.1 내지 5 wt%; 질소 헤테로고리 화합물 10 내지 40 wt%; 알킬 글리콜 에테르 30 내지 70 wt%; 및 물 잔량;을 포함함으로써, 인쇄회로기판(PCB) 제조시 솔더링 공정 중 리플로우 이후 기판 상에 잔류하는 플럭스 및 레진 등의 이물질에 대한 세정력이 뛰어난 PCB 준수계 세정제 조성물에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS |
| title | PCB SEMI-AQUEOUS CLEANING COMPOSITION FOR PCB |
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