SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package includes: a package substrate; a bridge chip disposed on the package substrate and including an insulating base layer made of an organic insulating material and a conductive layer provided in the insulating base layer; a first sealing la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE SUNG HYUK, LEE HYEON JUN, KWON YONG TAE, YU HAN JU, HAN SEONG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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