Nozzle type deposition apparatus
The present invention relates to a nozzle-type deposition apparatus. More specifically, according to the present invention, as a source for depositing a pattern is provided and deposited as many times as necessary for pattern deposition, an amount of the source used can be minimized. In addition, as...
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| creator | SUL BONG HO JUNG YU JONG JANG JAE YOUNG DO YOUNG WON |
| description | The present invention relates to a nozzle-type deposition apparatus. More specifically, according to the present invention, as a source for depositing a pattern is provided and deposited as many times as necessary for pattern deposition, an amount of the source used can be minimized. In addition, as the source is supplied only to a region where the pattern is to be formed, precise pattern deposition is possible and diffusion of the source is prevented. Accordingly, a phenomenon in which the source is deposited in another area may be fundamentally prevented. Also, since a heating gas is utilized, clogging of a pipe and a nozzle to which the source is supplied can be prevented. In addition, as the source is supplied in a nozzle manner, the deposition apparatus can be configured simply and efficiently. The nozzle-type deposition apparatus of the present invention comprises: a laser module; a first nozzle; a second nozzle; a nozzle housing; and a heater unit.
본 발명은 노즐형 증착장치에 관한 것으로, 더욱 상세하게는 패턴을 증착하기 위한 소스를 패턴 증착에 필요한 만큼 제공하여 증착함에 따라 소스의 사용량을 최소화할 수 있고, 패턴을 형성할 부위에만 소스를 공급함에 따라 정밀한 패턴 증착이 가능하고 소스의 확산을 방지하여 다른 부위에 소스가 증착되는 것을 원천적으로 막을 수 있고, 히팅 가스를 활용하여 소스가 공급되는 배관 및 노즐의 막힘을 방지할 수 있고, 노즐 방식으로 소스를 공급함에 따라 증착장치를 간이하고 효율적으로 구성할 수 있는 노즐형 증착장치에 관한 것이다. |
| format | Patent |
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본 발명은 노즐형 증착장치에 관한 것으로, 더욱 상세하게는 패턴을 증착하기 위한 소스를 패턴 증착에 필요한 만큼 제공하여 증착함에 따라 소스의 사용량을 최소화할 수 있고, 패턴을 형성할 부위에만 소스를 공급함에 따라 정밀한 패턴 증착이 가능하고 소스의 확산을 방지하여 다른 부위에 소스가 증착되는 것을 원천적으로 막을 수 있고, 히팅 가스를 활용하여 소스가 공급되는 배관 및 노즐의 막힘을 방지할 수 있고, 노즐 방식으로 소스를 공급함에 따라 증착장치를 간이하고 효율적으로 구성할 수 있는 노즐형 증착장치에 관한 것이다.</description><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230303&DB=EPODOC&CC=KR&NR=20230029357A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230303&DB=EPODOC&CC=KR&NR=20230029357A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUL BONG HO</creatorcontrib><creatorcontrib>JUNG YU JONG</creatorcontrib><creatorcontrib>JANG JAE YOUNG</creatorcontrib><creatorcontrib>DO YOUNG WON</creatorcontrib><title>Nozzle type deposition apparatus</title><description>The present invention relates to a nozzle-type deposition apparatus. More specifically, according to the present invention, as a source for depositing a pattern is provided and deposited as many times as necessary for pattern deposition, an amount of the source used can be minimized. In addition, as the source is supplied only to a region where the pattern is to be formed, precise pattern deposition is possible and diffusion of the source is prevented. Accordingly, a phenomenon in which the source is deposited in another area may be fundamentally prevented. Also, since a heating gas is utilized, clogging of a pipe and a nozzle to which the source is supplied can be prevented. In addition, as the source is supplied in a nozzle manner, the deposition apparatus can be configured simply and efficiently. The nozzle-type deposition apparatus of the present invention comprises: a laser module; a first nozzle; a second nozzle; a nozzle housing; and a heater unit.
본 발명은 노즐형 증착장치에 관한 것으로, 더욱 상세하게는 패턴을 증착하기 위한 소스를 패턴 증착에 필요한 만큼 제공하여 증착함에 따라 소스의 사용량을 최소화할 수 있고, 패턴을 형성할 부위에만 소스를 공급함에 따라 정밀한 패턴 증착이 가능하고 소스의 확산을 방지하여 다른 부위에 소스가 증착되는 것을 원천적으로 막을 수 있고, 히팅 가스를 활용하여 소스가 공급되는 배관 및 노즐의 막힘을 방지할 수 있고, 노즐 방식으로 소스를 공급함에 따라 증착장치를 간이하고 효율적으로 구성할 수 있는 노즐형 증착장치에 관한 것이다.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwy6-qyklVKKksSFVISS3IL84syczPU0gsKEgsSiwpLeZhYE1LzClO5YXS3AzKbq4hzh66QLXxqcUFicmpeakl8d5BRgZGxgYGRpbGpuaOxsSpAgAYWiaY</recordid><startdate>20230303</startdate><enddate>20230303</enddate><creator>SUL BONG HO</creator><creator>JUNG YU JONG</creator><creator>JANG JAE YOUNG</creator><creator>DO YOUNG WON</creator><scope>EVB</scope></search><sort><creationdate>20230303</creationdate><title>Nozzle type deposition apparatus</title><author>SUL BONG HO ; JUNG YU JONG ; JANG JAE YOUNG ; DO YOUNG WON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230029357A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SUL BONG HO</creatorcontrib><creatorcontrib>JUNG YU JONG</creatorcontrib><creatorcontrib>JANG JAE YOUNG</creatorcontrib><creatorcontrib>DO YOUNG WON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUL BONG HO</au><au>JUNG YU JONG</au><au>JANG JAE YOUNG</au><au>DO YOUNG WON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Nozzle type deposition apparatus</title><date>2023-03-03</date><risdate>2023</risdate><abstract>The present invention relates to a nozzle-type deposition apparatus. More specifically, according to the present invention, as a source for depositing a pattern is provided and deposited as many times as necessary for pattern deposition, an amount of the source used can be minimized. In addition, as the source is supplied only to a region where the pattern is to be formed, precise pattern deposition is possible and diffusion of the source is prevented. Accordingly, a phenomenon in which the source is deposited in another area may be fundamentally prevented. Also, since a heating gas is utilized, clogging of a pipe and a nozzle to which the source is supplied can be prevented. In addition, as the source is supplied in a nozzle manner, the deposition apparatus can be configured simply and efficiently. The nozzle-type deposition apparatus of the present invention comprises: a laser module; a first nozzle; a second nozzle; a nozzle housing; and a heater unit.
본 발명은 노즐형 증착장치에 관한 것으로, 더욱 상세하게는 패턴을 증착하기 위한 소스를 패턴 증착에 필요한 만큼 제공하여 증착함에 따라 소스의 사용량을 최소화할 수 있고, 패턴을 형성할 부위에만 소스를 공급함에 따라 정밀한 패턴 증착이 가능하고 소스의 확산을 방지하여 다른 부위에 소스가 증착되는 것을 원천적으로 막을 수 있고, 히팅 가스를 활용하여 소스가 공급되는 배관 및 노즐의 막힘을 방지할 수 있고, 노즐 방식으로 소스를 공급함에 따라 증착장치를 간이하고 효율적으로 구성할 수 있는 노즐형 증착장치에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Nozzle type deposition apparatus |
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