CIRCUIT BOARD AND PACKAGE SUBSTRATE HAVING THE SAME

A circuit board according to an embodiment comprises: an insulating layer which includes an upper surface and a lower surface; and a through electrode which penetrates the upper and lower surfaces of the insulating layer. The through electrode includes: a first electrode part which is arranged adjac...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BAE JAE MAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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