VAPOR CHAMBER AND WORKING FLUID USED THEREFOR
The present invention provides a vapor chamber and a working fluid used therein. The vapor chamber comprises: an upper plate which has a first structural surface; a lower plate which has a second structural surface facing the first structural surface; a vapor channel which is formed on at least one...
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| creator | CHO YOUNG SOO KONG YU CHAN KIM YONG DAE BIMAL SUBEDI |
| description | The present invention provides a vapor chamber and a working fluid used therein. The vapor chamber comprises: an upper plate which has a first structural surface; a lower plate which has a second structural surface facing the first structural surface; a vapor channel which is formed on at least one of the first structural surface and the second structural surface, and forms a passage in which a gaseous working fluid flows from an evaporation part to a condensation part due to thermal energy; and a liquid channel which is formed on at least one of the first structural surface and the second structural surface or between the first structural surface and the second structural surface, and forms a passage in which the liquid working fluid moves from the condensation part to the evaporation part by capillary action. The working fluid includes a mixture of acetone and hydrofluorocarbon (HFC). Therefore, the vapor chamber can be more safely and effectively used in general electronic equipment and industrial fields.
본 발명은, 제1 구조면을 구비하는 상판; 상기 제1 구조면과 마주하는 제2 구조면을 구비하는 하판; 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나에 형성되고, 기상의 작동 유체가 열 에너지에 의해 증발부로부터 응축부로 유동하는 통로를 형성하는 기상 채널; 및 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나 또는 그들 사이에 형성되고, 액상의 작동 유체가 모세관력에 의해 상기 응축부로부터 상기 증발부로 이동하는 통로를 형성하는 액상 채널을 포함하고, 상기 작동 유체는, 아세톤과 하이드로플루오로카본(HydroFluoroCarbon)의 혼합물을 포함하는, 베이퍼 챔버 및 그에 사용되는 작동 유체를 제공한다. |
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본 발명은, 제1 구조면을 구비하는 상판; 상기 제1 구조면과 마주하는 제2 구조면을 구비하는 하판; 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나에 형성되고, 기상의 작동 유체가 열 에너지에 의해 증발부로부터 응축부로 유동하는 통로를 형성하는 기상 채널; 및 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나 또는 그들 사이에 형성되고, 액상의 작동 유체가 모세관력에 의해 상기 응축부로부터 상기 증발부로 이동하는 통로를 형성하는 액상 채널을 포함하고, 상기 작동 유체는, 아세톤과 하이드로플루오로카본(HydroFluoroCarbon)의 혼합물을 포함하는, 베이퍼 챔버 및 그에 사용되는 작동 유체를 제공한다.</description><language>eng ; kor</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230127&DB=EPODOC&CC=KR&NR=20230013860A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230127&DB=EPODOC&CC=KR&NR=20230013860A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHO YOUNG SOO</creatorcontrib><creatorcontrib>KONG YU CHAN</creatorcontrib><creatorcontrib>KIM YONG DAE</creatorcontrib><creatorcontrib>BIMAL SUBEDI</creatorcontrib><title>VAPOR CHAMBER AND WORKING FLUID USED THEREFOR</title><description>The present invention provides a vapor chamber and a working fluid used therein. The vapor chamber comprises: an upper plate which has a first structural surface; a lower plate which has a second structural surface facing the first structural surface; a vapor channel which is formed on at least one of the first structural surface and the second structural surface, and forms a passage in which a gaseous working fluid flows from an evaporation part to a condensation part due to thermal energy; and a liquid channel which is formed on at least one of the first structural surface and the second structural surface or between the first structural surface and the second structural surface, and forms a passage in which the liquid working fluid moves from the condensation part to the evaporation part by capillary action. The working fluid includes a mixture of acetone and hydrofluorocarbon (HFC). Therefore, the vapor chamber can be more safely and effectively used in general electronic equipment and industrial fields.
본 발명은, 제1 구조면을 구비하는 상판; 상기 제1 구조면과 마주하는 제2 구조면을 구비하는 하판; 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나에 형성되고, 기상의 작동 유체가 열 에너지에 의해 증발부로부터 응축부로 유동하는 통로를 형성하는 기상 채널; 및 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나 또는 그들 사이에 형성되고, 액상의 작동 유체가 모세관력에 의해 상기 응축부로부터 상기 증발부로 이동하는 통로를 형성하는 액상 채널을 포함하고, 상기 작동 유체는, 아세톤과 하이드로플루오로카본(HydroFluoroCarbon)의 혼합물을 포함하는, 베이퍼 챔버 및 그에 사용되는 작동 유체를 제공한다.</description><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANcwzwD1Jw9nD0dXINUnD0c1EI9w_y9vRzV3DzCfV0UQgNdnVRCPFwDXJ18w_iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkbGBgaGxhZmBo7GxKkCADn3JhQ</recordid><startdate>20230127</startdate><enddate>20230127</enddate><creator>CHO YOUNG SOO</creator><creator>KONG YU CHAN</creator><creator>KIM YONG DAE</creator><creator>BIMAL SUBEDI</creator><scope>EVB</scope></search><sort><creationdate>20230127</creationdate><title>VAPOR CHAMBER AND WORKING FLUID USED THEREFOR</title><author>CHO YOUNG SOO ; KONG YU CHAN ; KIM YONG DAE ; BIMAL SUBEDI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230013860A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHO YOUNG SOO</creatorcontrib><creatorcontrib>KONG YU CHAN</creatorcontrib><creatorcontrib>KIM YONG DAE</creatorcontrib><creatorcontrib>BIMAL SUBEDI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHO YOUNG SOO</au><au>KONG YU CHAN</au><au>KIM YONG DAE</au><au>BIMAL SUBEDI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VAPOR CHAMBER AND WORKING FLUID USED THEREFOR</title><date>2023-01-27</date><risdate>2023</risdate><abstract>The present invention provides a vapor chamber and a working fluid used therein. The vapor chamber comprises: an upper plate which has a first structural surface; a lower plate which has a second structural surface facing the first structural surface; a vapor channel which is formed on at least one of the first structural surface and the second structural surface, and forms a passage in which a gaseous working fluid flows from an evaporation part to a condensation part due to thermal energy; and a liquid channel which is formed on at least one of the first structural surface and the second structural surface or between the first structural surface and the second structural surface, and forms a passage in which the liquid working fluid moves from the condensation part to the evaporation part by capillary action. The working fluid includes a mixture of acetone and hydrofluorocarbon (HFC). Therefore, the vapor chamber can be more safely and effectively used in general electronic equipment and industrial fields.
본 발명은, 제1 구조면을 구비하는 상판; 상기 제1 구조면과 마주하는 제2 구조면을 구비하는 하판; 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나에 형성되고, 기상의 작동 유체가 열 에너지에 의해 증발부로부터 응축부로 유동하는 통로를 형성하는 기상 채널; 및 상기 제1 구조면 및 상기 제2 구조면 중 적어도 하나 또는 그들 사이에 형성되고, 액상의 작동 유체가 모세관력에 의해 상기 응축부로부터 상기 증발부로 이동하는 통로를 형성하는 액상 채널을 포함하고, 상기 작동 유체는, 아세톤과 하이드로플루오로카본(HydroFluoroCarbon)의 혼합물을 포함하는, 베이퍼 챔버 및 그에 사용되는 작동 유체를 제공한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS |
| title | VAPOR CHAMBER AND WORKING FLUID USED THEREFOR |
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