ADHESIVE COMPOSITION ADHESIVE FILM OPTICAL FILM AND ELECTRONIC DEVICE
The present application relates to an adhesive composition, an adhesive film, an optical film, and an electronic device. The adhesive composition of the present invention includes a compound having a structure represented by A n^-. A is represented by the chemical formula A, and n is 1 or 2. The adh...
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| creator | SON SEONKYOUNG AN JUNHYUN LEE HOYONG KIM JI YOUNG LE DUY HIEU LEE YEON KEUN |
| description | The present application relates to an adhesive composition, an adhesive film, an optical film, and an electronic device. The adhesive composition of the present invention includes a compound having a structure represented by A n^-. A is represented by the chemical formula A, and n is 1 or 2. The adhesive composition according to an exemplary embodiment of the present specification has excellent light resistance, heat resistance, and moisture resistance.
본 출원은 점착제 조성물, 점착 필름, 광학 필름 및 전자 소자에 관한 것이다. |
| format | Patent |
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본 출원은 점착제 조성물, 점착 필름, 광학 필름 및 전자 소자에 관한 것이다.</description><language>eng ; kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221212&DB=EPODOC&CC=KR&NR=20220163605A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221212&DB=EPODOC&CC=KR&NR=20220163605A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SON SEONKYOUNG</creatorcontrib><creatorcontrib>AN JUNHYUN</creatorcontrib><creatorcontrib>LEE HOYONG</creatorcontrib><creatorcontrib>KIM JI YOUNG</creatorcontrib><creatorcontrib>LE DUY HIEU</creatorcontrib><creatorcontrib>LEE YEON KEUN</creatorcontrib><title>ADHESIVE COMPOSITION ADHESIVE FILM OPTICAL FILM AND ELECTRONIC DEVICE</title><description>The present application relates to an adhesive composition, an adhesive film, an optical film, and an electronic device. The adhesive composition of the present invention includes a compound having a structure represented by A n^-. A is represented by the chemical formula A, and n is 1 or 2. The adhesive composition according to an exemplary embodiment of the present specification has excellent light resistance, heat resistance, and moisture resistance.
본 출원은 점착제 조성물, 점착 필름, 광학 필름 및 전자 소자에 관한 것이다.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1dPFwDfYMc1Vw9vcN8A_2DPH091OAC7p5-vgq-AeEeDo7-kA4jn4uCq4-rs4hQf5-ns4KLq5hns6uPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7Uk3jvIyMDIyMDQzNjMwNTRmDhVACBYLKs</recordid><startdate>20221212</startdate><enddate>20221212</enddate><creator>SON SEONKYOUNG</creator><creator>AN JUNHYUN</creator><creator>LEE HOYONG</creator><creator>KIM JI YOUNG</creator><creator>LE DUY HIEU</creator><creator>LEE YEON KEUN</creator><scope>EVB</scope></search><sort><creationdate>20221212</creationdate><title>ADHESIVE COMPOSITION ADHESIVE FILM OPTICAL FILM AND ELECTRONIC DEVICE</title><author>SON SEONKYOUNG ; AN JUNHYUN ; LEE HOYONG ; KIM JI YOUNG ; LE DUY HIEU ; LEE YEON KEUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220163605A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SON SEONKYOUNG</creatorcontrib><creatorcontrib>AN JUNHYUN</creatorcontrib><creatorcontrib>LEE HOYONG</creatorcontrib><creatorcontrib>KIM JI YOUNG</creatorcontrib><creatorcontrib>LE DUY HIEU</creatorcontrib><creatorcontrib>LEE YEON KEUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SON SEONKYOUNG</au><au>AN JUNHYUN</au><au>LEE HOYONG</au><au>KIM JI YOUNG</au><au>LE DUY HIEU</au><au>LEE YEON KEUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE COMPOSITION ADHESIVE FILM OPTICAL FILM AND ELECTRONIC DEVICE</title><date>2022-12-12</date><risdate>2022</risdate><abstract>The present application relates to an adhesive composition, an adhesive film, an optical film, and an electronic device. The adhesive composition of the present invention includes a compound having a structure represented by A n^-. A is represented by the chemical formula A, and n is 1 or 2. The adhesive composition according to an exemplary embodiment of the present specification has excellent light resistance, heat resistance, and moisture resistance.
본 출원은 점착제 조성물, 점착 필름, 광학 필름 및 전자 소자에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION ADHESIVE FILM OPTICAL FILM AND ELECTRONIC DEVICE |
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