Cooling pad for smartphone and smartphone case using the same
The present invention relates to a cooling pad for a smartphone, which dissipates heat generated from a smartphone using a phase change material having a liquid-solid phase change at a predetermined temperature. The cooling pad is integrally formed by modularizing phase change material cells partiti...
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| creator | SON, KWANG OH SON, SANG YEOUL |
| description | The present invention relates to a cooling pad for a smartphone, which dissipates heat generated from a smartphone using a phase change material having a liquid-solid phase change at a predetermined temperature. The cooling pad is integrally formed by modularizing phase change material cells partitioned in all directions by a bonding line formed by bonding a heat transfer sheet and a heat dissipation sheet to prevent an inclining phenomenon while evenly distributing and disposing a phase change material. The thickness of the heat transfer sheet and the heat dissipation sheet is formed to be 0.2 to 0.6 mm to increase heat transfer and heat dissipation. A surface of the heat transfer sheet is formed in a horizontal plane to be in close contact with a smartphone to increase the heat transfer capability. Also, a surface of the phase change material cell is formed in a curved and convex shape from the bonding line of the heat dissipation sheet to increase a surface cross-sectional area so as to improve the heat dissipation capability of the phase change material. Therefore, a heat dissipation effect can increase.
본 발명은 소정 온도에서 액체-고체 상변화를 하는 상변화물질을 이용하여 스마트폰에서 발생하는 발열을 방열하는 스마트폰용 쿨링패드에 관한 것으로, 상기 쿨링패드는 상변화물질이 골고루 분산 배치됨과 동시에 쏠림 현상이 없도록 열전달시트와 방열시트를 접합하여 형성된 접합라인에 의해 사방으로 구획되는 상변화물질 셀을 모듈화하여 일체로 형성하고, 상기 열전달시트와 방열시트의 두께는 열전달과 방열을 높이기 위해 0.2mm~0.6mm로 형성하고, 상기 열전달시트의 표면은 열전달 능력을 높이기 위해 스마트폰과 밀착되도록 수평면으로 형성하고, 상기 상변화물질 셀의 표면은 표면 단면적을 증가시켜 상변화물질의 방열 능력을 높이기 위해 방열시트의 접합라인으로부터 곡면이며 볼록한 형상으로 형성한 것을 특징으로 한다. |
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본 발명은 소정 온도에서 액체-고체 상변화를 하는 상변화물질을 이용하여 스마트폰에서 발생하는 발열을 방열하는 스마트폰용 쿨링패드에 관한 것으로, 상기 쿨링패드는 상변화물질이 골고루 분산 배치됨과 동시에 쏠림 현상이 없도록 열전달시트와 방열시트를 접합하여 형성된 접합라인에 의해 사방으로 구획되는 상변화물질 셀을 모듈화하여 일체로 형성하고, 상기 열전달시트와 방열시트의 두께는 열전달과 방열을 높이기 위해 0.2mm~0.6mm로 형성하고, 상기 열전달시트의 표면은 열전달 능력을 높이기 위해 스마트폰과 밀착되도록 수평면으로 형성하고, 상기 상변화물질 셀의 표면은 표면 단면적을 증가시켜 상변화물질의 방열 능력을 높이기 위해 방열시트의 접합라인으로부터 곡면이며 볼록한 형상으로 형성한 것을 특징으로 한다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HAND CARRIED BAGS ; HAND OR TRAVELLING ARTICLES ; HUMAN NECESSITIES ; LUGGAGE ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; PURSES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221011&DB=EPODOC&CC=KR&NR=20220136833A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221011&DB=EPODOC&CC=KR&NR=20220136833A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SON, KWANG OH</creatorcontrib><creatorcontrib>SON, SANG YEOUL</creatorcontrib><title>Cooling pad for smartphone and smartphone case using the same</title><description>The present invention relates to a cooling pad for a smartphone, which dissipates heat generated from a smartphone using a phase change material having a liquid-solid phase change at a predetermined temperature. The cooling pad is integrally formed by modularizing phase change material cells partitioned in all directions by a bonding line formed by bonding a heat transfer sheet and a heat dissipation sheet to prevent an inclining phenomenon while evenly distributing and disposing a phase change material. The thickness of the heat transfer sheet and the heat dissipation sheet is formed to be 0.2 to 0.6 mm to increase heat transfer and heat dissipation. A surface of the heat transfer sheet is formed in a horizontal plane to be in close contact with a smartphone to increase the heat transfer capability. Also, a surface of the phase change material cell is formed in a curved and convex shape from the bonding line of the heat dissipation sheet to increase a surface cross-sectional area so as to improve the heat dissipation capability of the phase change material. Therefore, a heat dissipation effect can increase.
본 발명은 소정 온도에서 액체-고체 상변화를 하는 상변화물질을 이용하여 스마트폰에서 발생하는 발열을 방열하는 스마트폰용 쿨링패드에 관한 것으로, 상기 쿨링패드는 상변화물질이 골고루 분산 배치됨과 동시에 쏠림 현상이 없도록 열전달시트와 방열시트를 접합하여 형성된 접합라인에 의해 사방으로 구획되는 상변화물질 셀을 모듈화하여 일체로 형성하고, 상기 열전달시트와 방열시트의 두께는 열전달과 방열을 높이기 위해 0.2mm~0.6mm로 형성하고, 상기 열전달시트의 표면은 열전달 능력을 높이기 위해 스마트폰과 밀착되도록 수평면으로 형성하고, 상기 상변화물질 셀의 표면은 표면 단면적을 증가시켜 상변화물질의 방열 능력을 높이기 위해 방열시트의 접합라인으로부터 곡면이며 볼록한 형상으로 형성한 것을 특징으로 한다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HAND CARRIED BAGS</subject><subject>HAND OR TRAVELLING ARTICLES</subject><subject>HUMAN NECESSITIES</subject><subject>LUGGAGE</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>PURSES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1zs_PycxLVyhITFFIyy9SKM5NLCopyMjPS1VIzEtB5iYnFqcqlBaDFJdkpCoUJ-am8jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwMjIwNDYzMLY2NHY-JUAQDAxzDB</recordid><startdate>20221011</startdate><enddate>20221011</enddate><creator>SON, KWANG OH</creator><creator>SON, SANG YEOUL</creator><scope>EVB</scope></search><sort><creationdate>20221011</creationdate><title>Cooling pad for smartphone and smartphone case using the same</title><author>SON, KWANG OH ; SON, SANG YEOUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220136833A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HAND CARRIED BAGS</topic><topic>HAND OR TRAVELLING ARTICLES</topic><topic>HUMAN NECESSITIES</topic><topic>LUGGAGE</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>PURSES</topic><toplevel>online_resources</toplevel><creatorcontrib>SON, KWANG OH</creatorcontrib><creatorcontrib>SON, SANG YEOUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SON, KWANG OH</au><au>SON, SANG YEOUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooling pad for smartphone and smartphone case using the same</title><date>2022-10-11</date><risdate>2022</risdate><abstract>The present invention relates to a cooling pad for a smartphone, which dissipates heat generated from a smartphone using a phase change material having a liquid-solid phase change at a predetermined temperature. The cooling pad is integrally formed by modularizing phase change material cells partitioned in all directions by a bonding line formed by bonding a heat transfer sheet and a heat dissipation sheet to prevent an inclining phenomenon while evenly distributing and disposing a phase change material. The thickness of the heat transfer sheet and the heat dissipation sheet is formed to be 0.2 to 0.6 mm to increase heat transfer and heat dissipation. A surface of the heat transfer sheet is formed in a horizontal plane to be in close contact with a smartphone to increase the heat transfer capability. Also, a surface of the phase change material cell is formed in a curved and convex shape from the bonding line of the heat dissipation sheet to increase a surface cross-sectional area so as to improve the heat dissipation capability of the phase change material. Therefore, a heat dissipation effect can increase.
본 발명은 소정 온도에서 액체-고체 상변화를 하는 상변화물질을 이용하여 스마트폰에서 발생하는 발열을 방열하는 스마트폰용 쿨링패드에 관한 것으로, 상기 쿨링패드는 상변화물질이 골고루 분산 배치됨과 동시에 쏠림 현상이 없도록 열전달시트와 방열시트를 접합하여 형성된 접합라인에 의해 사방으로 구획되는 상변화물질 셀을 모듈화하여 일체로 형성하고, 상기 열전달시트와 방열시트의 두께는 열전달과 방열을 높이기 위해 0.2mm~0.6mm로 형성하고, 상기 열전달시트의 표면은 열전달 능력을 높이기 위해 스마트폰과 밀착되도록 수평면으로 형성하고, 상기 상변화물질 셀의 표면은 표면 단면적을 증가시켜 상변화물질의 방열 능력을 높이기 위해 방열시트의 접합라인으로부터 곡면이며 볼록한 형상으로 형성한 것을 특징으로 한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CARRIED BAGS HAND OR TRAVELLING ARTICLES HUMAN NECESSITIES LUGGAGE MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PURSES |
| title | Cooling pad for smartphone and smartphone case using the same |
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