전자파 차폐 필름

롤 보관 시에 블로킹이 생기기 어렵고, 내습성 및 내굴곡성이 우수한 전자파 차폐 필름을 제공한다. 본 발명의 전자파 차폐 필름은 보호층과, 차폐층이 적층된 전자파 차폐 필름으로서, 상기 보호층은, 산가가 2000∼4000g/eq, 또한, Tg가 0℃ 이상인 우레탄계 수지와, 평균 입자 직경이 10㎛ 이하인 비도전성 필러를 포함하고, 상기 보호층의 전체 중량에 대한 상기 비도전성 필러의 중량 비율은 10∼40 중량%인 것을 특징으로 한다. Provided is an electromagnetic wave shield film which...

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KAMINO KENJI
description 롤 보관 시에 블로킹이 생기기 어렵고, 내습성 및 내굴곡성이 우수한 전자파 차폐 필름을 제공한다. 본 발명의 전자파 차폐 필름은 보호층과, 차폐층이 적층된 전자파 차폐 필름으로서, 상기 보호층은, 산가가 2000∼4000g/eq, 또한, Tg가 0℃ 이상인 우레탄계 수지와, 평균 입자 직경이 10㎛ 이하인 비도전성 필러를 포함하고, 상기 보호층의 전체 중량에 대한 상기 비도전성 필러의 중량 비율은 10∼40 중량%인 것을 특징으로 한다. Provided is an electromagnetic wave shield film which is less likely to cause blocking when stored in a rolled form, and which has excellent moisture resistance and bending resistance. An electromagnetic wave shield film according to the present invention in which a protective layer and a shield layer are laminated is characterized in that: the protective layer includes a urethane resin having an acid value of 2,000-4,000 g/eq and a Tg of at least 0 °C, and a non-conductive filler having an average particle diameter of at most 10 μm; and the weight percentage of the non-conductive filler to the total weight of the protective layer is 10-40 wt%.
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Provided is an electromagnetic wave shield film which is less likely to cause blocking when stored in a rolled form, and which has excellent moisture resistance and bending resistance. An electromagnetic wave shield film according to the present invention in which a protective layer and a shield layer are laminated is characterized in that: the protective layer includes a urethane resin having an acid value of 2,000-4,000 g/eq and a Tg of at least 0 °C, and a non-conductive filler having an average particle diameter of at most 10 μm; and the weight percentage of the non-conductive filler to the total weight of the protective layer is 10-40 wt%.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220906&amp;DB=EPODOC&amp;CC=KR&amp;NR=20220123474A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220906&amp;DB=EPODOC&amp;CC=KR&amp;NR=20220123474A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOYAGI YOSHIHIKO</creatorcontrib><creatorcontrib>KAMINO KENJI</creatorcontrib><title>전자파 차폐 필름</title><description>롤 보관 시에 블로킹이 생기기 어렵고, 내습성 및 내굴곡성이 우수한 전자파 차폐 필름을 제공한다. 본 발명의 전자파 차폐 필름은 보호층과, 차폐층이 적층된 전자파 차폐 필름으로서, 상기 보호층은, 산가가 2000∼4000g/eq, 또한, Tg가 0℃ 이상인 우레탄계 수지와, 평균 입자 직경이 10㎛ 이하인 비도전성 필러를 포함하고, 상기 보호층의 전체 중량에 대한 상기 비도전성 필러의 중량 비율은 10∼40 중량%인 것을 특징으로 한다. Provided is an electromagnetic wave shield film which is less likely to cause blocking when stored in a rolled form, and which has excellent moisture resistance and bending resistance. An electromagnetic wave shield film according to the present invention in which a protective layer and a shield layer are laminated is characterized in that: the protective layer includes a urethane resin having an acid value of 2,000-4,000 g/eq and a Tg of at least 0 °C, and a non-conductive filler having an average particle diameter of at most 10 μm; and the weight percentage of the non-conductive filler to the total weight of the protective layer is 10-40 wt%.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB_s6DlzbwJb3t6FN5sWPG2f4LC26ktr5e18DCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwMjIwNDI2MTcxNHY-JUAQC_2iiq</recordid><startdate>20220906</startdate><enddate>20220906</enddate><creator>AOYAGI YOSHIHIKO</creator><creator>KAMINO KENJI</creator><scope>EVB</scope></search><sort><creationdate>20220906</creationdate><title>전자파 차폐 필름</title><author>AOYAGI YOSHIHIKO ; KAMINO KENJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220123474A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>AOYAGI YOSHIHIKO</creatorcontrib><creatorcontrib>KAMINO KENJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AOYAGI YOSHIHIKO</au><au>KAMINO KENJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>전자파 차폐 필름</title><date>2022-09-06</date><risdate>2022</risdate><abstract>롤 보관 시에 블로킹이 생기기 어렵고, 내습성 및 내굴곡성이 우수한 전자파 차폐 필름을 제공한다. 본 발명의 전자파 차폐 필름은 보호층과, 차폐층이 적층된 전자파 차폐 필름으로서, 상기 보호층은, 산가가 2000∼4000g/eq, 또한, Tg가 0℃ 이상인 우레탄계 수지와, 평균 입자 직경이 10㎛ 이하인 비도전성 필러를 포함하고, 상기 보호층의 전체 중량에 대한 상기 비도전성 필러의 중량 비율은 10∼40 중량%인 것을 특징으로 한다. Provided is an electromagnetic wave shield film which is less likely to cause blocking when stored in a rolled form, and which has excellent moisture resistance and bending resistance. An electromagnetic wave shield film according to the present invention in which a protective layer and a shield layer are laminated is characterized in that: the protective layer includes a urethane resin having an acid value of 2,000-4,000 g/eq and a Tg of at least 0 °C, and a non-conductive filler having an average particle diameter of at most 10 μm; and the weight percentage of the non-conductive filler to the total weight of the protective layer is 10-40 wt%.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
title 전자파 차폐 필름
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