ETCHANT COMPOSITION

The present invention relates to an etchant composition for etching silver (Ag) or a film containing the silver, and a manufacturing method thereof. According to the etchant composition of the present invention, in an etchant process of silver or a metal film containing the silver, etchant character...

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Hauptverfasser: EUN HEE CHUN, JUNG SEOK IL, KIM IK JOON, JEONG MIN GYEONG, LEE BO YEON, KIM SE HOON, KIM YANG RYOUNG, PARK SANG SEUNG
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Sprache:eng ; kor
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creator EUN HEE CHUN
JUNG SEOK IL
KIM IK JOON
JEONG MIN GYEONG
LEE BO YEON
KIM SE HOON
KIM YANG RYOUNG
PARK SANG SEUNG
description The present invention relates to an etchant composition for etching silver (Ag) or a film containing the silver, and a manufacturing method thereof. According to the etchant composition of the present invention, in an etchant process of silver or a metal film containing the silver, etchant characteristics may be improved as a residue is improved without damage to a lower film, generation of a precipitate is prevented, and a defect in a bias is minimized during formation of a fine wire. The etchant composition of the present invention comprises: a nitric acid; an inorganic phosphoric acid or a salt thereof; an organic phosphoric acid or a salt thereof; a sulfur compound; and an organic acid. 본 발명은 은(Ag) 또는 은을 함유하는 막의 식각을 위한 식각액 조성물 및 그 제조방법에 관한 것이다. 본 발명의 식각액 조성물에 따르면, 은 또는 은을 포함하는 금속막의 식각 공정에 있어서, 하부막의 손상 없이 잔사를 개선하고, 석출물의 발생을 방지하고, 미세 배선 형성 시 바이어스의 불량을 최소화함에 따라 식각 특성을 개선할 수 있다.
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According to the etchant composition of the present invention, in an etchant process of silver or a metal film containing the silver, etchant characteristics may be improved as a residue is improved without damage to a lower film, generation of a precipitate is prevented, and a defect in a bias is minimized during formation of a fine wire. 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According to the etchant composition of the present invention, in an etchant process of silver or a metal film containing the silver, etchant characteristics may be improved as a residue is improved without damage to a lower film, generation of a precipitate is prevented, and a defect in a bias is minimized during formation of a fine wire. The etchant composition of the present invention comprises: a nitric acid; an inorganic phosphoric acid or a salt thereof; an organic phosphoric acid or a salt thereof; a sulfur compound; and an organic acid. 본 발명은 은(Ag) 또는 은을 함유하는 막의 식각을 위한 식각액 조성물 및 그 제조방법에 관한 것이다. 본 발명의 식각액 조성물에 따르면, 은 또는 은을 포함하는 금속막의 식각 공정에 있어서, 하부막의 손상 없이 잔사를 개선하고, 석출물의 발생을 방지하고, 미세 배선 형성 시 바이어스의 불량을 최소화함에 따라 식각 특성을 개선할 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
DYES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NATURAL RESINS
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
PAINTS
POLISHES
title ETCHANT COMPOSITION
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