CHEMICAL MECHANICAL POLISHING PAD AND POLISHING METHOD

Disclosed is a CMP polishing pad or layer made of a polyurethane reaction product of a reaction mixture including a liquid polyol substance containing: (i) a liquid aromatic isocyanate substance including a linear aromatic isocyanate-end urethane pre-copolymer or one or more aromatic di-isocyanate;...

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Bibliographische Detailangaben
Hauptverfasser:	TERESA BRUGAROLAS BRUFAU, BRYAN E. BARTON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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