RESIN COMPOSITION FOR STRAPS OF WEARABLE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Disclosed are a resin composition for a strap of a wearable electronic device and a preparation method thereof. The resin composition for a strap of a wearable electronic device according to various embodiments disclosed in the present document comprises: 50 to 80 wt% of a thermoplastic resin having...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI JIHYOUNG, CHOI DUCKSHIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed are a resin composition for a strap of a wearable electronic device and a preparation method thereof. The resin composition for a strap of a wearable electronic device according to various embodiments disclosed in the present document comprises: 50 to 80 wt% of a thermoplastic resin having a hardness of 80 Shore A or less; and 20 to 50 wt% of a high specific gravity inorganic compound and has a specific gravity of 1.6 or more, a hardness of 50 to 80 Shore A, a tensile strength of 15 to 27 MPa, and a tear strength of 53 to 79 kgF/cm2. 웨어러블 전자 장치의 스트랩용 수지 조성물 및 이의 제조 방법이 개시된다. 본 문서에 개시된 다양한 실시예에 따른 웨어러블 전자 장치의 스트랩용 수지 조성물은, 80 쇼어 A 이하의 경도를 가지는 열가소성 수지 50 내지 80 중량% 및 고비중 무기화합물 20 내지 50 중량%를 포함하고, 1.6 이상의 비중, 50 내지 80 쇼어 A의 경도, 15 내지 27MPa의 인장강도 및 53 내지 79kgF/cm2의 인열강도를 가질 수 있다.