Laser Bonding Apparatus for Semiconductor Chip

Disclosed is a semiconductor chip laser bonding device, which includes: a mask module for selectively transmitting a laser beam to an upper surface region of a semiconductor chip located at a bonding position; a laser light emitting module located on the top of the mask module and irradiating the la...

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Bibliographische Detailangaben
Hauptverfasser:	LEE SOUK WOO, KWON OH CHUL, KIM HYOUNG JUNE, KIM BYUNG KUK, BACK MIN SU, HAN MAENG KUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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