Laser Bonding Apparatus for Semiconductor Chip

Disclosed is a semiconductor chip laser bonding device, which includes: a mask module for selectively transmitting a laser beam to an upper surface region of a semiconductor chip located at a bonding position; a laser light emitting module located on the top of the mask module and irradiating the la...

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Bibliographische Detailangaben
Hauptverfasser:	LEE SOUK WOO, KWON OH CHUL, KIM HYOUNG JUNE, KIM BYUNG KUK, BACK MIN SU, HAN MAENG KUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Disclosed is a semiconductor chip laser bonding device, which includes: a mask module for selectively transmitting a laser beam to an upper surface region of a semiconductor chip located at a bonding position; a laser light emitting module located on the top of the mask module and irradiating the laser beam to the top of the mask module; a mask transfer module for gripping the mask module and transporting the mask module to a cleaning position; and a mask cleaning module located at the cleaning position and cleaning a lower surface of the mask module facing the semiconductor chip. 본 발명은 본딩 위치에 위치하는 반도체 칩의 상면 영역으로 레이저 빔을 선택적으로 투과시키는 마스크 모듈과, 상기 마스크 모듈의 상부에 위치하여 상기 레이저 빔을 상기 마스크 모듈의 상부로 조사하는 레이저 발광 모듈과, 상기 마스크 모듈을 파지하여 세정 위치로 이송시키는 마스크 이송 모듈 및 상기 세정 위치에 위치하며 상기 마스크 모듈에서 상기 반도체 칩과 대향하는 하면을 세정하는 마스크 세정 모듈을 포함하는 반도체 칩 레이저 본딩 장치를 개시한다.