HEATER FOR A VERTICAL DIFFUSION FURNACE

A heater for a vertical diffusion furnace may include a lower plate, a heating wire, and an upper plate. The lower plate may be disposed at a lower portion of the vertical diffusion furnace. The lower plate may have a receiving groove. The heating wire may be disposed in the receiving groove. The up...

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1. Verfasser:	LEE HANG SOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	LEE HANG SOO
description	A heater for a vertical diffusion furnace may include a lower plate, a heating wire, and an upper plate. The lower plate may be disposed at a lower portion of the vertical diffusion furnace. The lower plate may have a receiving groove. The heating wire may be disposed in the receiving groove. The upper plate may be coupled to the lower plate. Therefore, it is possible to keep the heating temperature of a semiconductor substrate constant during the diffusion process, and thus the defect rate of the diffusion process can be greatly reduced. 종형 확산로용 히터는 하판, 열선 및 상판을 포함할 수 있다. 상기 하판은 종형 확산로 내의 하부에 배치될 수 있다. 상기 하판은 수용홈을 가질 수 있다. 상기 열선은 상기 수용홈 내에 배치될 수 있다. 상기 상판은 상기 하판 상에 결합될 수 있다. 따라서, 확산 공정 동안 반도체 기판의 히팅 온도를 일정하게 유지할 수가 있게 되어, 확산 공정의 불량율을 크게 낮출 수 있다.
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The lower plate may have a receiving groove. The heating wire may be disposed in the receiving groove. The upper plate may be coupled to the lower plate. Therefore, it is possible to keep the heating temperature of a semiconductor substrate constant during the diffusion process, and thus the defect rate of the diffusion process can be greatly reduced. 종형 확산로용 히터는 하판, 열선 및 상판을 포함할 수 있다. 상기 하판은 종형 확산로 내의 하부에 배치될 수 있다. 상기 하판은 수용홈을 가질 수 있다. 상기 열선은 상기 수용홈 내에 배치될 수 있다. 상기 상판은 상기 하판 상에 결합될 수 있다. 따라서, 확산 공정 동안 반도체 기판의 히팅 온도를 일정하게 유지할 수가 있게 되어, 확산 공정의 불량율을 크게 낮출 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220707&DB=EPODOC&CC=KR&NR=20220095545A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220707&DB=EPODOC&CC=KR&NR=20220095545A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE HANG SOO</creatorcontrib><title>HEATER FOR A VERTICAL DIFFUSION FURNACE</title><description>A heater for a vertical diffusion furnace may include a lower plate, a heating wire, and an upper plate. The lower plate may be disposed at a lower portion of the vertical diffusion furnace. The lower plate may have a receiving groove. The heating wire may be disposed in the receiving groove. The upper plate may be coupled to the lower plate. Therefore, it is possible to keep the heating temperature of a semiconductor substrate constant during the diffusion process, and thus the defect rate of the diffusion process can be greatly reduced. 종형 확산로용 히터는 하판, 열선 및 상판을 포함할 수 있다. 상기 하판은 종형 확산로 내의 하부에 배치될 수 있다. 상기 하판은 수용홈을 가질 수 있다. 상기 열선은 상기 수용홈 내에 배치될 수 있다. 상기 상판은 상기 하판 상에 결합될 수 있다. 따라서, 확산 공정 동안 반도체 기판의 히팅 온도를 일정하게 유지할 수가 있게 되어, 확산 공정의 불량율을 크게 낮출 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3cHUMcQ1ScPMPUnBUCHMNCvF0dvRRcPF0cwsN9vT3U3ALDfJzdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkZGBgaWpqYmpo7GxKkCAFZuJHQ</recordid><startdate>20220707</startdate><enddate>20220707</enddate><creator>LEE HANG SOO</creator><scope>EVB</scope></search><sort><creationdate>20220707</creationdate><title>HEATER FOR A VERTICAL DIFFUSION FURNACE</title><author>LEE HANG SOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220095545A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE HANG SOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE HANG SOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEATER FOR A VERTICAL DIFFUSION FURNACE</title><date>2022-07-07</date><risdate>2022</risdate><abstract>A heater for a vertical diffusion furnace may include a lower plate, a heating wire, and an upper plate. The lower plate may be disposed at a lower portion of the vertical diffusion furnace. The lower plate may have a receiving groove. The heating wire may be disposed in the receiving groove. The upper plate may be coupled to the lower plate. Therefore, it is possible to keep the heating temperature of a semiconductor substrate constant during the diffusion process, and thus the defect rate of the diffusion process can be greatly reduced. 종형 확산로용 히터는 하판, 열선 및 상판을 포함할 수 있다. 상기 하판은 종형 확산로 내의 하부에 배치될 수 있다. 상기 하판은 수용홈을 가질 수 있다. 상기 열선은 상기 수용홈 내에 배치될 수 있다. 상기 상판은 상기 하판 상에 결합될 수 있다. 따라서, 확산 공정 동안 반도체 기판의 히팅 온도를 일정하게 유지할 수가 있게 되어, 확산 공정의 불량율을 크게 낮출 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	HEATER FOR A VERTICAL DIFFUSION FURNACE
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