SUBSTRATE BACKSIDE TEXTURING
여기에 기술하는 실시형태는 리소그래피 왜곡을 저감시키기 위한 방법 및 장치에 관한 것이다. 반도체 기판의 배면이 텍스처화될 수 있다. 다음으로, 텍스처화된 배면을 갖는 반도체 기판 상에 리소그래피 공정이 수행될 수 있다. Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic proc...
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| creator | HULI LIOR DEVILLIERS ANTON J FONSECA CARLOS A HOOGE JOSHUA S RATHSACK BENJAMEN SMITH JEFFREY KODAMA TERUHIKO |
| description | 여기에 기술하는 실시형태는 리소그래피 왜곡을 저감시키기 위한 방법 및 장치에 관한 것이다. 반도체 기판의 배면이 텍스처화될 수 있다. 다음으로, 텍스처화된 배면을 갖는 반도체 기판 상에 리소그래피 공정이 수행될 수 있다.
Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic process may be performed on the semiconductor substrate having the texturized backside. |
| format | Patent |
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Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic process may be performed on the semiconductor substrate having the texturized backside.</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220610&DB=EPODOC&CC=KR&NR=20220078733A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220610&DB=EPODOC&CC=KR&NR=20220078733A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HULI LIOR</creatorcontrib><creatorcontrib>DEVILLIERS ANTON J</creatorcontrib><creatorcontrib>FONSECA CARLOS A</creatorcontrib><creatorcontrib>HOOGE JOSHUA S</creatorcontrib><creatorcontrib>RATHSACK BENJAMEN</creatorcontrib><creatorcontrib>SMITH JEFFREY</creatorcontrib><creatorcontrib>KODAMA TERUHIKO</creatorcontrib><title>SUBSTRATE BACKSIDE TEXTURING</title><description>여기에 기술하는 실시형태는 리소그래피 왜곡을 저감시키기 위한 방법 및 장치에 관한 것이다. 반도체 기판의 배면이 텍스처화될 수 있다. 다음으로, 텍스처화된 배면을 갖는 반도체 기판 상에 리소그래피 공정이 수행될 수 있다.
Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic process may be performed on the semiconductor substrate having the texturized backside.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAJDnUKDglyDHFVcHJ09g72dHFVCHGNCAkN8vRz52FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGRgYG5hbmxsaOxsSpAgAJvyHg</recordid><startdate>20220610</startdate><enddate>20220610</enddate><creator>HULI LIOR</creator><creator>DEVILLIERS ANTON J</creator><creator>FONSECA CARLOS A</creator><creator>HOOGE JOSHUA S</creator><creator>RATHSACK BENJAMEN</creator><creator>SMITH JEFFREY</creator><creator>KODAMA TERUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20220610</creationdate><title>SUBSTRATE BACKSIDE TEXTURING</title><author>HULI LIOR ; DEVILLIERS ANTON J ; FONSECA CARLOS A ; HOOGE JOSHUA S ; RATHSACK BENJAMEN ; SMITH JEFFREY ; KODAMA TERUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220078733A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HULI LIOR</creatorcontrib><creatorcontrib>DEVILLIERS ANTON J</creatorcontrib><creatorcontrib>FONSECA CARLOS A</creatorcontrib><creatorcontrib>HOOGE JOSHUA S</creatorcontrib><creatorcontrib>RATHSACK BENJAMEN</creatorcontrib><creatorcontrib>SMITH JEFFREY</creatorcontrib><creatorcontrib>KODAMA TERUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HULI LIOR</au><au>DEVILLIERS ANTON J</au><au>FONSECA CARLOS A</au><au>HOOGE JOSHUA S</au><au>RATHSACK BENJAMEN</au><au>SMITH JEFFREY</au><au>KODAMA TERUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE BACKSIDE TEXTURING</title><date>2022-06-10</date><risdate>2022</risdate><abstract>여기에 기술하는 실시형태는 리소그래피 왜곡을 저감시키기 위한 방법 및 장치에 관한 것이다. 반도체 기판의 배면이 텍스처화될 수 있다. 다음으로, 텍스처화된 배면을 갖는 반도체 기판 상에 리소그래피 공정이 수행될 수 있다.
Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic process may be performed on the semiconductor substrate having the texturized backside.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | SUBSTRATE BACKSIDE TEXTURING |
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