원자 스케일 처리를 위한 초고순도 조건
원자 스케일 처리 장치가 제공된다. 장치는 반응기(100) 및 유도 결합 플라즈마 소스(10)를 포함할 수 있다. 반응기는 내부 표면들의 일부가 반응기의 내부 체적(156)을 형성하도록 내부 표면(154) 및 외부 표면(152)을 가질 수 있다. 반응기의 내부 체적은 기판(118)을 지지하기 위한 고정 조립체(158)를 포함할 수 있으며, 여기서 내부 체적 내의 각 배경 불순물의 부분 압력은 원자 스케일 처리 동안 표면 반응들에서 상기 불순물들의 역할을 감소시키기 위해 10-6 Torr 미만일 수 있다. An apparatus fo...
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creator | RAYNER GILBERT BRUCE JR CARLSEN DANIEL EDWARD O'TOOLE NOEL CHRISTOPHER |
description | 원자 스케일 처리 장치가 제공된다. 장치는 반응기(100) 및 유도 결합 플라즈마 소스(10)를 포함할 수 있다. 반응기는 내부 표면들의 일부가 반응기의 내부 체적(156)을 형성하도록 내부 표면(154) 및 외부 표면(152)을 가질 수 있다. 반응기의 내부 체적은 기판(118)을 지지하기 위한 고정 조립체(158)를 포함할 수 있으며, 여기서 내부 체적 내의 각 배경 불순물의 부분 압력은 원자 스케일 처리 동안 표면 반응들에서 상기 불순물들의 역할을 감소시키기 위해 10-6 Torr 미만일 수 있다.
An apparatus for atomic scale processing is provided. The apparatus comprising a reactor (100) having inner and outer surfaces; wherein at least a portion of the inner surfaces define an internal volume (156) of the reactor (100); a fixture assembly (158) positioned within the internal volume (156) of the reactor (100) having a surface configured to hold a substrate within the internal volume (156) of the reactor (100); and an inductively coupled plasma source. The inductively coupled plasma source and the reactor (100) are connected at a first connection point (112). A base pressure of the reactor (100) is between approximately 10-4 and 10-2 Torr. A partial pressure of each background impurity within the internal volume (156) of the reactor (100) is below approximately 10-6 Torr to reduce said background impurities role in surface reactions before, during and after atomic scale processing. |
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An apparatus for atomic scale processing is provided. The apparatus comprising a reactor (100) having inner and outer surfaces; wherein at least a portion of the inner surfaces define an internal volume (156) of the reactor (100); a fixture assembly (158) positioned within the internal volume (156) of the reactor (100) having a surface configured to hold a substrate within the internal volume (156) of the reactor (100); and an inductively coupled plasma source. The inductively coupled plasma source and the reactor (100) are connected at a first connection point (112). A base pressure of the reactor (100) is between approximately 10-4 and 10-2 Torr. A partial pressure of each background impurity within the internal volume (156) of the reactor (100) is below approximately 10-6 Torr to reduce said background impurities role in surface reactions before, during and after atomic scale processing.</description><language>kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220527&DB=EPODOC&CC=KR&NR=20220069931A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220527&DB=EPODOC&CC=KR&NR=20220069931A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAYNER GILBERT BRUCE JR</creatorcontrib><creatorcontrib>CARLSEN DANIEL EDWARD</creatorcontrib><creatorcontrib>O'TOOLE NOEL CHRISTOPHER</creatorcontrib><title>원자 스케일 처리를 위한 초고순도 조건</title><description>원자 스케일 처리 장치가 제공된다. 장치는 반응기(100) 및 유도 결합 플라즈마 소스(10)를 포함할 수 있다. 반응기는 내부 표면들의 일부가 반응기의 내부 체적(156)을 형성하도록 내부 표면(154) 및 외부 표면(152)을 가질 수 있다. 반응기의 내부 체적은 기판(118)을 지지하기 위한 고정 조립체(158)를 포함할 수 있으며, 여기서 내부 체적 내의 각 배경 불순물의 부분 압력은 원자 스케일 처리 동안 표면 반응들에서 상기 불순물들의 역할을 감소시키기 위해 10-6 Torr 미만일 수 있다.
An apparatus for atomic scale processing is provided. The apparatus comprising a reactor (100) having inner and outer surfaces; wherein at least a portion of the inner surfaces define an internal volume (156) of the reactor (100); a fixture assembly (158) positioned within the internal volume (156) of the reactor (100) having a surface configured to hold a substrate within the internal volume (156) of the reactor (100); and an inductively coupled plasma source. The inductively coupled plasma source and the reactor (100) are connected at a first connection point (112). A base pressure of the reactor (100) is between approximately 10-4 and 10-2 Torr. A partial pressure of each background impurity within the internal volume (156) of the reactor (100) is below approximately 10-6 Torr to reduce said background impurities role in surface reactions before, during and after atomic scale processing.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB9M3vCm3kTFN50LXmzp-HN3D0KbzbNeL1szeulQNaclrdT5yi82dLxavOCNx1zXve3KLxZuOHVxi08DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSTeO8jIwMjIwMDM0tLY0NGYOFUALJo9PA</recordid><startdate>20220527</startdate><enddate>20220527</enddate><creator>RAYNER GILBERT BRUCE JR</creator><creator>CARLSEN DANIEL EDWARD</creator><creator>O'TOOLE NOEL CHRISTOPHER</creator><scope>EVB</scope></search><sort><creationdate>20220527</creationdate><title>원자 스케일 처리를 위한 초고순도 조건</title><author>RAYNER GILBERT BRUCE JR ; CARLSEN DANIEL EDWARD ; O'TOOLE NOEL CHRISTOPHER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220069931A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>RAYNER GILBERT BRUCE JR</creatorcontrib><creatorcontrib>CARLSEN DANIEL EDWARD</creatorcontrib><creatorcontrib>O'TOOLE NOEL CHRISTOPHER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAYNER GILBERT BRUCE JR</au><au>CARLSEN DANIEL EDWARD</au><au>O'TOOLE NOEL CHRISTOPHER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>원자 스케일 처리를 위한 초고순도 조건</title><date>2022-05-27</date><risdate>2022</risdate><abstract>원자 스케일 처리 장치가 제공된다. 장치는 반응기(100) 및 유도 결합 플라즈마 소스(10)를 포함할 수 있다. 반응기는 내부 표면들의 일부가 반응기의 내부 체적(156)을 형성하도록 내부 표면(154) 및 외부 표면(152)을 가질 수 있다. 반응기의 내부 체적은 기판(118)을 지지하기 위한 고정 조립체(158)를 포함할 수 있으며, 여기서 내부 체적 내의 각 배경 불순물의 부분 압력은 원자 스케일 처리 동안 표면 반응들에서 상기 불순물들의 역할을 감소시키기 위해 10-6 Torr 미만일 수 있다.
An apparatus for atomic scale processing is provided. The apparatus comprising a reactor (100) having inner and outer surfaces; wherein at least a portion of the inner surfaces define an internal volume (156) of the reactor (100); a fixture assembly (158) positioned within the internal volume (156) of the reactor (100) having a surface configured to hold a substrate within the internal volume (156) of the reactor (100); and an inductively coupled plasma source. The inductively coupled plasma source and the reactor (100) are connected at a first connection point (112). A base pressure of the reactor (100) is between approximately 10-4 and 10-2 Torr. A partial pressure of each background impurity within the internal volume (156) of the reactor (100) is below approximately 10-6 Torr to reduce said background impurities role in surface reactions before, during and after atomic scale processing.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | 원자 스케일 처리를 위한 초고순도 조건 |
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