Semiconductor package

An objective to be solved by the present invention is to provide a semiconductor package capable of improving reliability by preventing a short circuit. The semiconductor package comprises: a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconduct...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KWON OHGUK, SEO SUNKYOUNG, KIM NAMHOON, KIM HYOEUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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