반도체 세정 장치용 부재

열 변형되기 어렵고, 금속이 용출되기 어려운 반도체 세정 장치용 부재를 제공한다. 탄소 섬유와 테트라플루오로에틸렌/퍼플루오로(알킬비닐에테르) 공중합체가 열 융착된 프리프레그를 포함하는 반도체 세정 장치용 부재이다. Provided are members for semiconductor cleaning apparatuses, the members being resistant to thermal deformation and less likely to cause metal release. The disclosure relates to a...

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Bibliographische Detailangaben
Hauptverfasser:	MURAKAMI SHINJI, YUKAWA HIROKAZU, MASUI TOSHIAKI, HAGI KEISUKE
Format:	Patent
Sprache:	kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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