APPARATUS FOR REPAIRING DEVICE
One embodiment of the present invention provides a device for repairing an element that prevents damage to a new element and enables to perform a safe repair process. Here, the device for repairing the element comprises a stamp for transferring a connection material and a stamp for transferring an e...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KIM CHAN KIM KWANG SEOP JANG BONG KYUN YOON MIN AH LIM HYUNG JUN WON SE JEONG OH MIN SUB KIM JAE HYUN LEE HAK JOO |
| description | One embodiment of the present invention provides a device for repairing an element that prevents damage to a new element and enables to perform a safe repair process. Here, the device for repairing the element comprises a stamp for transferring a connection material and a stamp for transferring an element. The stamp for transferring the connection material transfers a new connection material to a repair area for which the element is not transferred on a substrate. The stamp for transferring the element transfers a new element to the new connection material. The stamp for transferring the element has a load control part for an element that bends and deforms when a pressing force is applied so that a zero stiffness load that is smaller than that of a failure limit load of the new element is applied to the new element.
본 발명의 일실시예는 신규 소자의 파손이 방지되도록 하고, 안전한 리페어 공정이 수행될 수 있도록 하는 소자 리페어 장치를 제공한다. 여기서, 소자 리페어 장치는 접속소재 전사용 스탬프 그리고 소자 전사용 스탬프를 포함한다. 접속소재 전사용 스탬프는 기판 상에서 소자가 전사되지 않은 리페어 영역에 신규 접속소재를 전사한다. 소자 전사용 스탬프는 신규 접속소재에 신규 소자를 전사한다. 소자 전사용 스탬프는, 가압력이 가해지면 굽힘 변형되어 신규 소자의 파손 한계 하중보다 작은 제로강성(Zero Stiffness) 하중이 신규 소자에 가해지도록 하는 소자용 하중 제어부를 가진다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20220028883A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20220028883A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20220028883A3</originalsourceid><addsrcrecordid>eNrjZJBzDAhwDHIMCQ1WcPMPUghyDXD0DPL0c1dwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkZGBgZGFhYWxo7GxKkCADSPIjA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>APPARATUS FOR REPAIRING DEVICE</title><source>esp@cenet</source><creator>KIM CHAN ; KIM KWANG SEOP ; JANG BONG KYUN ; YOON MIN AH ; LIM HYUNG JUN ; WON SE JEONG ; OH MIN SUB ; KIM JAE HYUN ; LEE HAK JOO</creator><creatorcontrib>KIM CHAN ; KIM KWANG SEOP ; JANG BONG KYUN ; YOON MIN AH ; LIM HYUNG JUN ; WON SE JEONG ; OH MIN SUB ; KIM JAE HYUN ; LEE HAK JOO</creatorcontrib><description>One embodiment of the present invention provides a device for repairing an element that prevents damage to a new element and enables to perform a safe repair process. Here, the device for repairing the element comprises a stamp for transferring a connection material and a stamp for transferring an element. The stamp for transferring the connection material transfers a new connection material to a repair area for which the element is not transferred on a substrate. The stamp for transferring the element transfers a new element to the new connection material. The stamp for transferring the element has a load control part for an element that bends and deforms when a pressing force is applied so that a zero stiffness load that is smaller than that of a failure limit load of the new element is applied to the new element.
본 발명의 일실시예는 신규 소자의 파손이 방지되도록 하고, 안전한 리페어 공정이 수행될 수 있도록 하는 소자 리페어 장치를 제공한다. 여기서, 소자 리페어 장치는 접속소재 전사용 스탬프 그리고 소자 전사용 스탬프를 포함한다. 접속소재 전사용 스탬프는 기판 상에서 소자가 전사되지 않은 리페어 영역에 신규 접속소재를 전사한다. 소자 전사용 스탬프는 신규 접속소재에 신규 소자를 전사한다. 소자 전사용 스탬프는, 가압력이 가해지면 굽힘 변형되어 신규 소자의 파손 한계 하중보다 작은 제로강성(Zero Stiffness) 하중이 신규 소자에 가해지도록 하는 소자용 하중 제어부를 가진다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220308&DB=EPODOC&CC=KR&NR=20220028883A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220308&DB=EPODOC&CC=KR&NR=20220028883A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM CHAN</creatorcontrib><creatorcontrib>KIM KWANG SEOP</creatorcontrib><creatorcontrib>JANG BONG KYUN</creatorcontrib><creatorcontrib>YOON MIN AH</creatorcontrib><creatorcontrib>LIM HYUNG JUN</creatorcontrib><creatorcontrib>WON SE JEONG</creatorcontrib><creatorcontrib>OH MIN SUB</creatorcontrib><creatorcontrib>KIM JAE HYUN</creatorcontrib><creatorcontrib>LEE HAK JOO</creatorcontrib><title>APPARATUS FOR REPAIRING DEVICE</title><description>One embodiment of the present invention provides a device for repairing an element that prevents damage to a new element and enables to perform a safe repair process. Here, the device for repairing the element comprises a stamp for transferring a connection material and a stamp for transferring an element. The stamp for transferring the connection material transfers a new connection material to a repair area for which the element is not transferred on a substrate. The stamp for transferring the element transfers a new element to the new connection material. The stamp for transferring the element has a load control part for an element that bends and deforms when a pressing force is applied so that a zero stiffness load that is smaller than that of a failure limit load of the new element is applied to the new element.
본 발명의 일실시예는 신규 소자의 파손이 방지되도록 하고, 안전한 리페어 공정이 수행될 수 있도록 하는 소자 리페어 장치를 제공한다. 여기서, 소자 리페어 장치는 접속소재 전사용 스탬프 그리고 소자 전사용 스탬프를 포함한다. 접속소재 전사용 스탬프는 기판 상에서 소자가 전사되지 않은 리페어 영역에 신규 접속소재를 전사한다. 소자 전사용 스탬프는 신규 접속소재에 신규 소자를 전사한다. 소자 전사용 스탬프는, 가압력이 가해지면 굽힘 변형되어 신규 소자의 파손 한계 하중보다 작은 제로강성(Zero Stiffness) 하중이 신규 소자에 가해지도록 하는 소자용 하중 제어부를 가진다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBzDAhwDHIMCQ1WcPMPUghyDXD0DPL0c1dwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkZGBgZGFhYWxo7GxKkCADSPIjA</recordid><startdate>20220308</startdate><enddate>20220308</enddate><creator>KIM CHAN</creator><creator>KIM KWANG SEOP</creator><creator>JANG BONG KYUN</creator><creator>YOON MIN AH</creator><creator>LIM HYUNG JUN</creator><creator>WON SE JEONG</creator><creator>OH MIN SUB</creator><creator>KIM JAE HYUN</creator><creator>LEE HAK JOO</creator><scope>EVB</scope></search><sort><creationdate>20220308</creationdate><title>APPARATUS FOR REPAIRING DEVICE</title><author>KIM CHAN ; KIM KWANG SEOP ; JANG BONG KYUN ; YOON MIN AH ; LIM HYUNG JUN ; WON SE JEONG ; OH MIN SUB ; KIM JAE HYUN ; LEE HAK JOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220028883A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM CHAN</creatorcontrib><creatorcontrib>KIM KWANG SEOP</creatorcontrib><creatorcontrib>JANG BONG KYUN</creatorcontrib><creatorcontrib>YOON MIN AH</creatorcontrib><creatorcontrib>LIM HYUNG JUN</creatorcontrib><creatorcontrib>WON SE JEONG</creatorcontrib><creatorcontrib>OH MIN SUB</creatorcontrib><creatorcontrib>KIM JAE HYUN</creatorcontrib><creatorcontrib>LEE HAK JOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM CHAN</au><au>KIM KWANG SEOP</au><au>JANG BONG KYUN</au><au>YOON MIN AH</au><au>LIM HYUNG JUN</au><au>WON SE JEONG</au><au>OH MIN SUB</au><au>KIM JAE HYUN</au><au>LEE HAK JOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR REPAIRING DEVICE</title><date>2022-03-08</date><risdate>2022</risdate><abstract>One embodiment of the present invention provides a device for repairing an element that prevents damage to a new element and enables to perform a safe repair process. Here, the device for repairing the element comprises a stamp for transferring a connection material and a stamp for transferring an element. The stamp for transferring the connection material transfers a new connection material to a repair area for which the element is not transferred on a substrate. The stamp for transferring the element transfers a new element to the new connection material. The stamp for transferring the element has a load control part for an element that bends and deforms when a pressing force is applied so that a zero stiffness load that is smaller than that of a failure limit load of the new element is applied to the new element.
본 발명의 일실시예는 신규 소자의 파손이 방지되도록 하고, 안전한 리페어 공정이 수행될 수 있도록 하는 소자 리페어 장치를 제공한다. 여기서, 소자 리페어 장치는 접속소재 전사용 스탬프 그리고 소자 전사용 스탬프를 포함한다. 접속소재 전사용 스탬프는 기판 상에서 소자가 전사되지 않은 리페어 영역에 신규 접속소재를 전사한다. 소자 전사용 스탬프는 신규 접속소재에 신규 소자를 전사한다. 소자 전사용 스탬프는, 가압력이 가해지면 굽힘 변형되어 신규 소자의 파손 한계 하중보다 작은 제로강성(Zero Stiffness) 하중이 신규 소자에 가해지도록 하는 소자용 하중 제어부를 가진다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; kor |
| recordid | cdi_epo_espacenet_KR20220028883A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | APPARATUS FOR REPAIRING DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T08%3A20%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM%20CHAN&rft.date=2022-03-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20220028883A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |