PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME
Provided are a photosensitive resin composition comprising a polyamic acid resin containing a structural unit represented by following chemical formula 1, a photosensitive resin film prepared using the same, and an electronic device comprising the photosensitive resin film. In chemical formula 1, ea...
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| creator | KO JINTAE BAEK TAEK JIN KIM SANG SOO KIM DO UK RYU JEEHYUN HONG CHUNGBEUM |
| description | Provided are a photosensitive resin composition comprising a polyamic acid resin containing a structural unit represented by following chemical formula 1, a photosensitive resin film prepared using the same, and an electronic device comprising the photosensitive resin film. In chemical formula 1, each substituent is the same as defined in the specification. The photosensitive resin composition according to one embodiment has high elongation even after low-temperature curing (220℃ or less) by comprising the polyamic acid resin containing a specific structural unit, and thus has excellent reliability in a package.
하기 화학식 1로 표시되는 구조단위 함유 폴리아믹산 수지를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 전자 소자가 제공된다. [화학식 1] JPEGpat00031.jpg4379 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.) |
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하기 화학식 1로 표시되는 구조단위 함유 폴리아믹산 수지를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 전자 소자가 제공된다. [화학식 1] JPEGpat00031.jpg4379 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220127&DB=EPODOC&CC=KR&NR=20220011057A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220127&DB=EPODOC&CC=KR&NR=20220011057A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO JINTAE</creatorcontrib><creatorcontrib>BAEK TAEK JIN</creatorcontrib><creatorcontrib>KIM SANG SOO</creatorcontrib><creatorcontrib>KIM DO UK</creatorcontrib><creatorcontrib>RYU JEEHYUN</creatorcontrib><creatorcontrib>HONG CHUNGBEUM</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME</title><description>Provided are a photosensitive resin composition comprising a polyamic acid resin containing a structural unit represented by following chemical formula 1, a photosensitive resin film prepared using the same, and an electronic device comprising the photosensitive resin film. In chemical formula 1, each substituent is the same as defined in the specification. The photosensitive resin composition according to one embodiment has high elongation even after low-temperature curing (220℃ or less) by comprising the polyamic acid resin containing a specific structural unit, and thus has excellent reliability in a package.
하기 화학식 1로 표시되는 구조단위 함유 폴리아믹산 수지를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 전자 소자가 제공된다. [화학식 1] JPEGpat00031.jpg4379 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgI8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PspYFXg4xjpGqTg6Oei4Orj6hwS5O_n6azg4hrm6eyqEApU4K4Q4uGqEOzo68rDwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-K9g4wMjIwMDAwNDUzNHY2JUwUAtrc0vg</recordid><startdate>20220127</startdate><enddate>20220127</enddate><creator>KO JINTAE</creator><creator>BAEK TAEK JIN</creator><creator>KIM SANG SOO</creator><creator>KIM DO UK</creator><creator>RYU JEEHYUN</creator><creator>HONG CHUNGBEUM</creator><scope>EVB</scope></search><sort><creationdate>20220127</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME</title><author>KO JINTAE ; BAEK TAEK JIN ; KIM SANG SOO ; KIM DO UK ; RYU JEEHYUN ; HONG CHUNGBEUM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220011057A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KO JINTAE</creatorcontrib><creatorcontrib>BAEK TAEK JIN</creatorcontrib><creatorcontrib>KIM SANG SOO</creatorcontrib><creatorcontrib>KIM DO UK</creatorcontrib><creatorcontrib>RYU JEEHYUN</creatorcontrib><creatorcontrib>HONG CHUNGBEUM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KO JINTAE</au><au>BAEK TAEK JIN</au><au>KIM SANG SOO</au><au>KIM DO UK</au><au>RYU JEEHYUN</au><au>HONG CHUNGBEUM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME</title><date>2022-01-27</date><risdate>2022</risdate><abstract>Provided are a photosensitive resin composition comprising a polyamic acid resin containing a structural unit represented by following chemical formula 1, a photosensitive resin film prepared using the same, and an electronic device comprising the photosensitive resin film. In chemical formula 1, each substituent is the same as defined in the specification. The photosensitive resin composition according to one embodiment has high elongation even after low-temperature curing (220℃ or less) by comprising the polyamic acid resin containing a specific structural unit, and thus has excellent reliability in a package.
하기 화학식 1로 표시되는 구조단위 함유 폴리아믹산 수지를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 전자 소자가 제공된다. [화학식 1] JPEGpat00031.jpg4379 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME |
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