Method for treating piping by-products using microwaves in semiconductor equipment and system therefore
Disclosed are a method for processing piping by-products using microwaves in semiconductor equipment, and a system thereof. According to an embodiment of the present invention, a system for processing piping by-products using microwaves comprises: a microwave application device for oxidizing or redu...
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| description | Disclosed are a method for processing piping by-products using microwaves in semiconductor equipment, and a system thereof. According to an embodiment of the present invention, a system for processing piping by-products using microwaves comprises: a microwave application device for oxidizing or reducing the by-products passing through a path in a pipe by applying microwaves to the pipe of the path through which the by-products generated in a semiconductor process chamber of the semiconductor equipment passes, using the applied microwaves; and a vacuum pump connected to the pipe and discharging the oxidized or reduced by-products using vacuum pumping.
반도체 장비에서 마이크로웨이브를 이용한 배관 부산물 처리 방법 및 그 시스템이 개시된다. 본 발명의 일 실시예에 따른 마이크로웨이브를 이용한 배관 부산물 처리 시스템은 반도체 장비의 반도체 공정 챔버에서 생성되는 부산물이 지나가는 경로의 배관에 마이크로웨이브를 가함으로써, 상기 가해진 마이크로웨이브를 이용하여 상기 배관 내의 경로를 지나가는 상기 부산물을 산화 또는 환원시키는 마이크로웨이브 인가 장치; 및 상기 배관에 연결되고, 상기 산화 또는 환원된 부산물을 진공 펌핑을 이용하여 배출시키는 진공 펌프를 포함한다. |
| format | Patent |
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반도체 장비에서 마이크로웨이브를 이용한 배관 부산물 처리 방법 및 그 시스템이 개시된다. 본 발명의 일 실시예에 따른 마이크로웨이브를 이용한 배관 부산물 처리 시스템은 반도체 장비의 반도체 공정 챔버에서 생성되는 부산물이 지나가는 경로의 배관에 마이크로웨이브를 가함으로써, 상기 가해진 마이크로웨이브를 이용하여 상기 배관 내의 경로를 지나가는 상기 부산물을 산화 또는 환원시키는 마이크로웨이브 인가 장치; 및 상기 배관에 연결되고, 상기 산화 또는 환원된 부산물을 진공 펌핑을 이용하여 배출시키는 진공 펌프를 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220124&DB=EPODOC&CC=KR&NR=20220009179A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220124&DB=EPODOC&CC=KR&NR=20220009179A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEO, TAE WOOK</creatorcontrib><title>Method for treating piping by-products using microwaves in semiconductor equipment and system therefore</title><description>Disclosed are a method for processing piping by-products using microwaves in semiconductor equipment, and a system thereof. According to an embodiment of the present invention, a system for processing piping by-products using microwaves comprises: a microwave application device for oxidizing or reducing the by-products passing through a path in a pipe by applying microwaves to the pipe of the path through which the by-products generated in a semiconductor process chamber of the semiconductor equipment passes, using the applied microwaves; and a vacuum pump connected to the pipe and discharging the oxidized or reduced by-products using vacuum pumping.
반도체 장비에서 마이크로웨이브를 이용한 배관 부산물 처리 방법 및 그 시스템이 개시된다. 본 발명의 일 실시예에 따른 마이크로웨이브를 이용한 배관 부산물 처리 시스템은 반도체 장비의 반도체 공정 챔버에서 생성되는 부산물이 지나가는 경로의 배관에 마이크로웨이브를 가함으로써, 상기 가해진 마이크로웨이브를 이용하여 상기 배관 내의 경로를 지나가는 상기 부산물을 산화 또는 환원시키는 마이크로웨이브 인가 장치; 및 상기 배관에 연결되고, 상기 산화 또는 환원된 부산물을 진공 펌핑을 이용하여 배출시키는 진공 펌프를 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwjAURLtxIeodPrguxLqQLkUUQdyI-xLbaRuwScz_VXp7E_AArh4zvJl51l0hvWuodYEkQIuxHXnjEx5T7oNrxlqYRk7NYOrgPvoNJmOJEbOzSYhrvEbjB1ghbRviiQUDSY-A-I1lNmv1k7H6cZGtT8f74ZzDuwrsdQ0LqS63QhWFUqrc7Mr99j_rC0BtQeM</recordid><startdate>20220124</startdate><enddate>20220124</enddate><creator>SEO, TAE WOOK</creator><scope>EVB</scope></search><sort><creationdate>20220124</creationdate><title>Method for treating piping by-products using microwaves in semiconductor equipment and system therefore</title><author>SEO, TAE WOOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220009179A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SEO, TAE WOOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEO, TAE WOOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for treating piping by-products using microwaves in semiconductor equipment and system therefore</title><date>2022-01-24</date><risdate>2022</risdate><abstract>Disclosed are a method for processing piping by-products using microwaves in semiconductor equipment, and a system thereof. According to an embodiment of the present invention, a system for processing piping by-products using microwaves comprises: a microwave application device for oxidizing or reducing the by-products passing through a path in a pipe by applying microwaves to the pipe of the path through which the by-products generated in a semiconductor process chamber of the semiconductor equipment passes, using the applied microwaves; and a vacuum pump connected to the pipe and discharging the oxidized or reduced by-products using vacuum pumping.
반도체 장비에서 마이크로웨이브를 이용한 배관 부산물 처리 방법 및 그 시스템이 개시된다. 본 발명의 일 실시예에 따른 마이크로웨이브를 이용한 배관 부산물 처리 시스템은 반도체 장비의 반도체 공정 챔버에서 생성되는 부산물이 지나가는 경로의 배관에 마이크로웨이브를 가함으로써, 상기 가해진 마이크로웨이브를 이용하여 상기 배관 내의 경로를 지나가는 상기 부산물을 산화 또는 환원시키는 마이크로웨이브 인가 장치; 및 상기 배관에 연결되고, 상기 산화 또는 환원된 부산물을 진공 펌핑을 이용하여 배출시키는 진공 펌프를 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Method for treating piping by-products using microwaves in semiconductor equipment and system therefore |
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