SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus provided with a processing part for performing a periphery process, and an inspection part for inspecting the periphery of a substrate can prevent a decrease in the throughput resulting from substrate transfer. A substrate processing apparatus according to the presen...
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| creator | TSUJIHASHI TATSUHIKO |
| description | A substrate processing apparatus provided with a processing part for performing a periphery process, and an inspection part for inspecting the periphery of a substrate can prevent a decrease in the throughput resulting from substrate transfer. A substrate processing apparatus according to the present disclosure includes a processing part, a transfer part, a large processing part transferring device, an inspection part, and a large inspection part transferring device. The processing part processes the periphery of the substrate. The transfer part transfers the substrate. The large processing part transferring device inserts or removes a substrate between a transfer part and a processing part. The inspection part inspects the processing state of the periphery of the substrate. The large inspection part transferring device takes out the substrate from the inspection part and moves the substrate into the transfer part.
주연부 처리를 행하는 처리부 및 기판의 주연부를 검사하는 검사부를 구비한 기판 처리 장치에 있어서, 기판 반송에 기인하는 스루풋의 저하를 억제한다. 본 개시에 따른 기판 처리 장치는, 처리부와, 전달부와, 대처리부 반송 장치와, 검사부와, 대검사부 반송 장치를 구비한다. 처리부는, 기판의 주연부를 처리한다. 전달부에서는, 기판의 전달이 행해진다. 대처리부 반송 장치는, 전달부와 처리부와의 사이에서 기판의 반입반출을 행한다. 검사부는, 기판의 주연부의 처리 상태를 검사한다. 대검사부 반송 장치는, 검사부로부터 기판을 취출하여 전달부로 반입한다. |
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주연부 처리를 행하는 처리부 및 기판의 주연부를 검사하는 검사부를 구비한 기판 처리 장치에 있어서, 기판 반송에 기인하는 스루풋의 저하를 억제한다. 본 개시에 따른 기판 처리 장치는, 처리부와, 전달부와, 대처리부 반송 장치와, 검사부와, 대검사부 반송 장치를 구비한다. 처리부는, 기판의 주연부를 처리한다. 전달부에서는, 기판의 전달이 행해진다. 대처리부 반송 장치는, 전달부와 처리부와의 사이에서 기판의 반입반출을 행한다. 검사부는, 기판의 주연부의 처리 상태를 검사한다. 대검사부 반송 장치는, 검사부로부터 기판을 취출하여 전달부로 반입한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220106&DB=EPODOC&CC=KR&NR=20220002112A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220106&DB=EPODOC&CC=KR&NR=20220002112A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUJIHASHI TATSUHIKO</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><description>A substrate processing apparatus provided with a processing part for performing a periphery process, and an inspection part for inspecting the periphery of a substrate can prevent a decrease in the throughput resulting from substrate transfer. A substrate processing apparatus according to the present disclosure includes a processing part, a transfer part, a large processing part transferring device, an inspection part, and a large inspection part transferring device. The processing part processes the periphery of the substrate. The transfer part transfers the substrate. The large processing part transferring device inserts or removes a substrate between a transfer part and a processing part. The inspection part inspects the processing state of the periphery of the substrate. The large inspection part transferring device takes out the substrate from the inspection part and moves the substrate into the transfer part.
주연부 처리를 행하는 처리부 및 기판의 주연부를 검사하는 검사부를 구비한 기판 처리 장치에 있어서, 기판 반송에 기인하는 스루풋의 저하를 억제한다. 본 개시에 따른 기판 처리 장치는, 처리부와, 전달부와, 대처리부 반송 장치와, 검사부와, 대검사부 반송 장치를 구비한다. 처리부는, 기판의 주연부를 처리한다. 전달부에서는, 기판의 전달이 행해진다. 대처리부 반송 장치는, 전달부와 처리부와의 사이에서 기판의 반입반출을 행한다. 검사부는, 기판의 주연부의 처리 상태를 검사한다. 대검사부 반송 장치는, 검사부로부터 기판을 취출하여 전달부로 반입한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBis4-rkoYFXi6xri4e_Cw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkvivYOMDIyMDAwMjAwNjRyNiVMFAD7LK1I</recordid><startdate>20220106</startdate><enddate>20220106</enddate><creator>TSUJIHASHI TATSUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20220106</creationdate><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><author>TSUJIHASHI TATSUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220002112A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUJIHASHI TATSUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUJIHASHI TATSUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><date>2022-01-06</date><risdate>2022</risdate><abstract>A substrate processing apparatus provided with a processing part for performing a periphery process, and an inspection part for inspecting the periphery of a substrate can prevent a decrease in the throughput resulting from substrate transfer. A substrate processing apparatus according to the present disclosure includes a processing part, a transfer part, a large processing part transferring device, an inspection part, and a large inspection part transferring device. The processing part processes the periphery of the substrate. The transfer part transfers the substrate. The large processing part transferring device inserts or removes a substrate between a transfer part and a processing part. The inspection part inspects the processing state of the periphery of the substrate. The large inspection part transferring device takes out the substrate from the inspection part and moves the substrate into the transfer part.
주연부 처리를 행하는 처리부 및 기판의 주연부를 검사하는 검사부를 구비한 기판 처리 장치에 있어서, 기판 반송에 기인하는 스루풋의 저하를 억제한다. 본 개시에 따른 기판 처리 장치는, 처리부와, 전달부와, 대처리부 반송 장치와, 검사부와, 대검사부 반송 장치를 구비한다. 처리부는, 기판의 주연부를 처리한다. 전달부에서는, 기판의 전달이 행해진다. 대처리부 반송 장치는, 전달부와 처리부와의 사이에서 기판의 반입반출을 행한다. 검사부는, 기판의 주연부의 처리 상태를 검사한다. 대검사부 반송 장치는, 검사부로부터 기판을 취출하여 전달부로 반입한다.</abstract><oa>free_for_read</oa></addata></record> |
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| title | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
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