인 시튜 챔버 세정 능력을 갖는 물리 기상 증착(PVD) 챔버

프로세스 키트 차폐부들 및 이들을 통합하는 프로세스 챔버들의 실시예들이 본 명세서에서 제공된다. 일부 실시예들에서 기판을 프로세싱하기 위한 프로세스 챔버에서 사용하도록 구성된 프로세스 키트는, 상부 부분 및 하부 부분을 갖는 원통형 바디를 갖는 차폐부; 프로세스 챔버의 벽들 상에 지지되도록 구성되며 차폐부를 지지하기 위한 래스팅 표면을 갖는 어댑터 섹션; 및 어댑터 섹션에 결합되며, 차폐부를 가열하기 위해 프로세스 챔버의 적어도 하나의 전원에 전기적으로 결합되도록 구성된 가열기를 포함한다. Embodiments of process...

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Hauptverfasser:	SONI VAIBHAV, CHONG HALBERT, SUBRAMANI ANANTHA K, HUA ZHONG QIANG, KRAUS PHILIP A, GUNG TZA JING, ZHOU LEI, KALATHIPARAMBIL KISHOR, ALLEN ADOLPH M, FAUNE VANESSA, SAVANDAIAH KIRANKUMAR NEELASANDRA
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Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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creator	SONI VAIBHAV CHONG HALBERT SUBRAMANI ANANTHA K HUA ZHONG QIANG KRAUS PHILIP A GUNG TZA JING ZHOU LEI KALATHIPARAMBIL KISHOR ALLEN ADOLPH M FAUNE VANESSA SAVANDAIAH KIRANKUMAR NEELASANDRA
description	프로세스 키트 차폐부들 및 이들을 통합하는 프로세스 챔버들의 실시예들이 본 명세서에서 제공된다. 일부 실시예들에서 기판을 프로세싱하기 위한 프로세스 챔버에서 사용하도록 구성된 프로세스 키트는, 상부 부분 및 하부 부분을 갖는 원통형 바디를 갖는 차폐부; 프로세스 챔버의 벽들 상에 지지되도록 구성되며 차폐부를 지지하기 위한 래스팅 표면을 갖는 어댑터 섹션; 및 어댑터 섹션에 결합되며, 차폐부를 가열하기 위해 프로세스 챔버의 적어도 하나의 전원에 전기적으로 결합되도록 구성된 가열기를 포함한다. Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20210156884A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20210156884A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20210156884A3</originalsourceid><addsrcrecordid>eNrjZPB6M3eHwpvuOW-75ii82Tjl9aYWhTctO94smKrwumvp6wVL38xtUXi1YdrrrikKr9fseb1sjcKrHRveNDcqvFk2982GlRoBYS6aUI08DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSTeO8jIwMjQwNDUzMLCxNGYOFUAFBFHnA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>인 시튜 챔버 세정 능력을 갖는 물리 기상 증착(PVD) 챔버</title><source>esp@cenet</source><creator>SONI VAIBHAV ; CHONG HALBERT ; SUBRAMANI ANANTHA K ; HUA ZHONG QIANG ; KRAUS PHILIP A ; GUNG TZA JING ; ZHOU LEI ; KALATHIPARAMBIL KISHOR ; ALLEN ADOLPH M ; FAUNE VANESSA ; SAVANDAIAH KIRANKUMAR NEELASANDRA</creator><creatorcontrib>SONI VAIBHAV ; CHONG HALBERT ; SUBRAMANI ANANTHA K ; HUA ZHONG QIANG ; KRAUS PHILIP A ; GUNG TZA JING ; ZHOU LEI ; KALATHIPARAMBIL KISHOR ; ALLEN ADOLPH M ; FAUNE VANESSA ; SAVANDAIAH KIRANKUMAR NEELASANDRA</creatorcontrib><description>프로세스 키트 차폐부들 및 이들을 통합하는 프로세스 챔버들의 실시예들이 본 명세서에서 제공된다. 일부 실시예들에서 기판을 프로세싱하기 위한 프로세스 챔버에서 사용하도록 구성된 프로세스 키트는, 상부 부분 및 하부 부분을 갖는 원통형 바디를 갖는 차폐부; 프로세스 챔버의 벽들 상에 지지되도록 구성되며 차폐부를 지지하기 위한 래스팅 표면을 갖는 어댑터 섹션; 및 어댑터 섹션에 결합되며, 차폐부를 가열하기 위해 프로세스 챔버의 적어도 하나의 전원에 전기적으로 결합되도록 구성된 가열기를 포함한다. Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.</description><language>kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211227&DB=EPODOC&CC=KR&NR=20210156884A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211227&DB=EPODOC&CC=KR&NR=20210156884A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONI VAIBHAV</creatorcontrib><creatorcontrib>CHONG HALBERT</creatorcontrib><creatorcontrib>SUBRAMANI ANANTHA K</creatorcontrib><creatorcontrib>HUA ZHONG QIANG</creatorcontrib><creatorcontrib>KRAUS PHILIP A</creatorcontrib><creatorcontrib>GUNG TZA JING</creatorcontrib><creatorcontrib>ZHOU LEI</creatorcontrib><creatorcontrib>KALATHIPARAMBIL KISHOR</creatorcontrib><creatorcontrib>ALLEN ADOLPH M</creatorcontrib><creatorcontrib>FAUNE VANESSA</creatorcontrib><creatorcontrib>SAVANDAIAH KIRANKUMAR NEELASANDRA</creatorcontrib><title>인 시튜 챔버 세정 능력을 갖는 물리 기상 증착(PVD) 챔버</title><description>프로세스 키트 차폐부들 및 이들을 통합하는 프로세스 챔버들의 실시예들이 본 명세서에서 제공된다. 일부 실시예들에서 기판을 프로세싱하기 위한 프로세스 챔버에서 사용하도록 구성된 프로세스 키트는, 상부 부분 및 하부 부분을 갖는 원통형 바디를 갖는 차폐부; 프로세스 챔버의 벽들 상에 지지되도록 구성되며 차폐부를 지지하기 위한 래스팅 표면을 갖는 어댑터 섹션; 및 어댑터 섹션에 결합되며, 차폐부를 가열하기 위해 프로세스 챔버의 적어도 하나의 전원에 전기적으로 결합되도록 구성된 가열기를 포함한다. Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB6M3eHwpvuOW-75ii82Tjl9aYWhTctO94smKrwumvp6wVL38xtUXi1YdrrrikKr9fseb1sjcKrHRveNDcqvFk2982GlRoBYS6aUI08DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSTeO8jIwMjQwNDUzMLCxNGYOFUAFBFHnA</recordid><startdate>20211227</startdate><enddate>20211227</enddate><creator>SONI VAIBHAV</creator><creator>CHONG HALBERT</creator><creator>SUBRAMANI ANANTHA K</creator><creator>HUA ZHONG QIANG</creator><creator>KRAUS PHILIP A</creator><creator>GUNG TZA JING</creator><creator>ZHOU LEI</creator><creator>KALATHIPARAMBIL KISHOR</creator><creator>ALLEN ADOLPH M</creator><creator>FAUNE VANESSA</creator><creator>SAVANDAIAH KIRANKUMAR NEELASANDRA</creator><scope>EVB</scope></search><sort><creationdate>20211227</creationdate><title>인 시튜 챔버 세정 능력을 갖는 물리 기상 증착(PVD) 챔버</title><author>SONI VAIBHAV ; CHONG HALBERT ; SUBRAMANI ANANTHA K ; HUA ZHONG QIANG ; KRAUS PHILIP A ; GUNG TZA JING ; ZHOU LEI ; KALATHIPARAMBIL KISHOR ; ALLEN ADOLPH M ; FAUNE VANESSA ; SAVANDAIAH KIRANKUMAR NEELASANDRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20210156884A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SONI VAIBHAV</creatorcontrib><creatorcontrib>CHONG HALBERT</creatorcontrib><creatorcontrib>SUBRAMANI ANANTHA K</creatorcontrib><creatorcontrib>HUA ZHONG QIANG</creatorcontrib><creatorcontrib>KRAUS PHILIP A</creatorcontrib><creatorcontrib>GUNG TZA JING</creatorcontrib><creatorcontrib>ZHOU LEI</creatorcontrib><creatorcontrib>KALATHIPARAMBIL KISHOR</creatorcontrib><creatorcontrib>ALLEN ADOLPH M</creatorcontrib><creatorcontrib>FAUNE VANESSA</creatorcontrib><creatorcontrib>SAVANDAIAH KIRANKUMAR NEELASANDRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONI VAIBHAV</au><au>CHONG HALBERT</au><au>SUBRAMANI ANANTHA K</au><au>HUA ZHONG QIANG</au><au>KRAUS PHILIP A</au><au>GUNG TZA JING</au><au>ZHOU LEI</au><au>KALATHIPARAMBIL KISHOR</au><au>ALLEN ADOLPH M</au><au>FAUNE VANESSA</au><au>SAVANDAIAH KIRANKUMAR NEELASANDRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>인 시튜 챔버 세정 능력을 갖는 물리 기상 증착(PVD) 챔버</title><date>2021-12-27</date><risdate>2021</risdate><abstract>프로세스 키트 차폐부들 및 이들을 통합하는 프로세스 챔버들의 실시예들이 본 명세서에서 제공된다. 일부 실시예들에서 기판을 프로세싱하기 위한 프로세스 챔버에서 사용하도록 구성된 프로세스 키트는, 상부 부분 및 하부 부분을 갖는 원통형 바디를 갖는 차폐부; 프로세스 챔버의 벽들 상에 지지되도록 구성되며 차폐부를 지지하기 위한 래스팅 표면을 갖는 어댑터 섹션; 및 어댑터 섹션에 결합되며, 차폐부를 가열하기 위해 프로세스 챔버의 적어도 하나의 전원에 전기적으로 결합되도록 구성된 가열기를 포함한다. Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title	인 시튜 챔버 세정 능력을 갖는 물리 기상 증착(PVD) 챔버
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