METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

A method and apparatus for manufacturing a semiconductor device are disclosed. The disclosed method of manufacturing the semiconductor device may include the steps of: forming a second conductivity type impurity region on the surface side of a first conductivity type substrate; forming a conductive...

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Bibliographische Detailangaben
1. Verfasser:	CHO, CHOONG RAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS COLORIMETRY COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR TRANSPORTING
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Beschreibung
Zusammenfassung:	A method and apparatus for manufacturing a semiconductor device are disclosed. The disclosed method of manufacturing the semiconductor device may include the steps of: forming a second conductivity type impurity region on the surface side of a first conductivity type substrate; forming a conductive layer on the surface of the substrate; and performing heat treatment while applying a voltage through the conductive layer and the electrode of an electrostatic chuck in a state in which the substrate is loaded on the electrostatic chuck. 반도체 소자의 제조방법 및 제조 장치가 개시되어 있다. 개시된 반도체 소자의 제조방법은, 제1 도전형 기판의 표면 측에 제2 도전형 불순물 영역을 형성하는 단계; 상기 기판의 표면 상에 전도층을 형성하는 단계; 및 상기 기판을 정전척 상에 로딩한 상태에서 상기 정전척의 전극 및 상기 전도층을 통해 전압을 인가하면서 열처리를 수행하는 단계;를 포함할 수 있다.