IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING THE SAME

According to one embodiment of the present invention, provided is an image sensor package for efficiently discharging heat generated from an image sensor to the outside through a plurality of surfaces. The image sensor package includes: a support member; a printed circuit board disposed on the suppo...

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Bibliographische Detailangaben
Hauptverfasser:	EOM SEONG SU, LEE HEE JUNG, LEE SOLIP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to one embodiment of the present invention, provided is an image sensor package for efficiently discharging heat generated from an image sensor to the outside through a plurality of surfaces. The image sensor package includes: a support member; a printed circuit board disposed on the support member and having a hole formed therein; an image sensor disposed in the hole; a filter layer disposed on the image sensor; and a heat dissipation member disposed between the image sensor and the support member in the hole. 본 발명의 한 실시예에 따른 이미지 센서 패키지는 지지부재, 상기 지지부재 상에 배치되며, 홀이 형성된 인쇄회로기판, 상기 홀 내에 배치된 이미지 센서, 상기 이미지 센서의 상에 배치된 필터층, 그리고, 상기 홀 내에서 상기 이미지 센서와 상기 지지부재 사이에 배치된 방열부재를 포함한다.