SEMICONDUCTOR DEVICE INCLUDING FRACTURED SEMICONDUCTOR DIES

A fractured semiconductor die is disclosed with a semiconductor device comprising the fractured semiconductor die. During fabrication of semiconductor dies on a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PERIYANNAN KIRUBAKARAN, HUYNH HOANG, LYONS EVERETT, PACHAMUTHU JAYAVEL, CR NARENDHIRAN, LINNEN DANIEL, DINH DAT, DHOLAKIA JAY
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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