PROCESSING APPARATUS AND PLATE-LIKE WORKPIECE LOADING/UNLOADING METHOD

A purpose of the present invention is to miniaturize a processing apparatus. A second plate-shaped workpiece (W2) before rough-grinding is held on a first suction surface (801) to be located above a holding surface (20a) through a horizontal moving means (83) and a vertical moving means (82), and a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ABE HIROKI, NEMOTO YOSHIMITSU, YAMANAKA SATOSHI, MIYAMOTO HIROKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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