WAFER TYPE SENSOR UNIT AND WAFER TYPE SENSOR UNIT MANUFACTURING METHOD

WAFER TYPE SENSOR UNIT AND WAFER TYPE SENSOR UNIT MANUFACTURING METHOD

A wafer type sensor unit is disclosed. A wafer type sensor unit according to the present invention includes a circuit board and an electronic device including a sensor installed on the circuit board. The electronic device may be arranged such that a center of gravity of the wafer-type sensor unit is...

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Hauptverfasser: CHO HYEONGJUN, HA SANGMIN, AHN DONGOK, SON SANGHYUN, SEO YONG JUN
Format: Patent
Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHO HYEONGJUN
HA SANGMIN
AHN DONGOK
SON SANGHYUN
SEO YONG JUN
description A wafer type sensor unit is disclosed. A wafer type sensor unit according to the present invention includes a circuit board and an electronic device including a sensor installed on the circuit board. The electronic device may be arranged such that a center of gravity of the wafer-type sensor unit is provided at a center of the sensor unit. The electronic device may further include a power supply; and a signal processing part for processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board. The center of gravity can be concentrated in the center part. 웨이퍼형 센서 유닛이 개시된다. 본 발명에 따른 웨이퍼형 센서 유닛은, 회로 기판과, 상기 회로 기판 상에 설치되는 센서를 포함한 전자 소자를 포함하되; 상기 전자 소자는 상기 웨이퍼형 센서 유닛의 무게 중심이 상기 센서 유닛의 중심부에 제공되도록 배치될 수 있다. 상기 전자 소자는 전원부; 및 상기 회로 기판 상의 신호를 처리하는 신호처리부;를 더 포함할 수 있다. 상기 웨이퍼형 센서 유닛은, 상기 회로 기판 상에 설치되는 하나 이상의 더미 소자;를 더 포함할 수 있다.
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A wafer type sensor unit according to the present invention includes a circuit board and an electronic device including a sensor installed on the circuit board. The electronic device may be arranged such that a center of gravity of the wafer-type sensor unit is provided at a center of the sensor unit. The electronic device may further include a power supply; and a signal processing part for processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board. The center of gravity can be concentrated in the center part. 웨이퍼형 센서 유닛이 개시된다. 본 발명에 따른 웨이퍼형 센서 유닛은, 회로 기판과, 상기 회로 기판 상에 설치되는 센서를 포함한 전자 소자를 포함하되; 상기 전자 소자는 상기 웨이퍼형 센서 유닛의 무게 중심이 상기 센서 유닛의 중심부에 제공되도록 배치될 수 있다. 상기 전자 소자는 전원부; 및 상기 회로 기판 상의 신호를 처리하는 신호처리부;를 더 포함할 수 있다. 상기 웨이퍼형 센서 유닛은, 상기 회로 기판 상에 설치되는 하나 이상의 더미 소자;를 더 포함할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210423&amp;DB=EPODOC&amp;CC=KR&amp;NR=20210044333A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210423&amp;DB=EPODOC&amp;CC=KR&amp;NR=20210044333A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHO HYEONGJUN</creatorcontrib><creatorcontrib>HA SANGMIN</creatorcontrib><creatorcontrib>AHN DONGOK</creatorcontrib><creatorcontrib>SON SANGHYUN</creatorcontrib><creatorcontrib>SEO YONG JUN</creatorcontrib><title>WAFER TYPE SENSOR UNIT AND WAFER TYPE SENSOR UNIT MANUFACTURING METHOD</title><description>A wafer type sensor unit is disclosed. 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The center of gravity can be concentrated in the center part. 웨이퍼형 센서 유닛이 개시된다. 본 발명에 따른 웨이퍼형 센서 유닛은, 회로 기판과, 상기 회로 기판 상에 설치되는 센서를 포함한 전자 소자를 포함하되; 상기 전자 소자는 상기 웨이퍼형 센서 유닛의 무게 중심이 상기 센서 유닛의 중심부에 제공되도록 배치될 수 있다. 상기 전자 소자는 전원부; 및 상기 회로 기판 상의 신호를 처리하는 신호처리부;를 더 포함할 수 있다. 상기 웨이퍼형 센서 유닛은, 상기 회로 기판 상에 설치되는 하나 이상의 더미 소자;를 더 포함할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALd3RzDVIIiQxwVQh29Qv2D1II9fMMUXD0c1HAIeXr6Bfq5ugcEhrk6eeu4Osa4uHvwsPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4r2DjAyMDA0MTEyMjY0djYlTBQBtjC0_</recordid><startdate>20210423</startdate><enddate>20210423</enddate><creator>CHO HYEONGJUN</creator><creator>HA SANGMIN</creator><creator>AHN DONGOK</creator><creator>SON SANGHYUN</creator><creator>SEO YONG JUN</creator><scope>EVB</scope></search><sort><creationdate>20210423</creationdate><title>WAFER TYPE SENSOR UNIT AND WAFER TYPE SENSOR UNIT MANUFACTURING METHOD</title><author>CHO HYEONGJUN ; HA SANGMIN ; AHN DONGOK ; SON SANGHYUN ; SEO YONG JUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20210044333A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHO HYEONGJUN</creatorcontrib><creatorcontrib>HA SANGMIN</creatorcontrib><creatorcontrib>AHN DONGOK</creatorcontrib><creatorcontrib>SON SANGHYUN</creatorcontrib><creatorcontrib>SEO YONG JUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHO HYEONGJUN</au><au>HA SANGMIN</au><au>AHN DONGOK</au><au>SON SANGHYUN</au><au>SEO YONG JUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER TYPE SENSOR UNIT AND WAFER TYPE SENSOR UNIT MANUFACTURING METHOD</title><date>2021-04-23</date><risdate>2021</risdate><abstract>A wafer type sensor unit is disclosed. A wafer type sensor unit according to the present invention includes a circuit board and an electronic device including a sensor installed on the circuit board. The electronic device may be arranged such that a center of gravity of the wafer-type sensor unit is provided at a center of the sensor unit. The electronic device may further include a power supply; and a signal processing part for processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board. The center of gravity can be concentrated in the center part. 웨이퍼형 센서 유닛이 개시된다. 본 발명에 따른 웨이퍼형 센서 유닛은, 회로 기판과, 상기 회로 기판 상에 설치되는 센서를 포함한 전자 소자를 포함하되; 상기 전자 소자는 상기 웨이퍼형 센서 유닛의 무게 중심이 상기 센서 유닛의 중심부에 제공되도록 배치될 수 있다. 상기 전자 소자는 전원부; 및 상기 회로 기판 상의 신호를 처리하는 신호처리부;를 더 포함할 수 있다. 상기 웨이퍼형 센서 유닛은, 상기 회로 기판 상에 설치되는 하나 이상의 더미 소자;를 더 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER TYPE SENSOR UNIT AND WAFER TYPE SENSOR UNIT MANUFACTURING METHOD
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