HEAT PROCESSING APPARATUS AND MATHOD FOR MANUFACTURING THE SAME

The present invention provides an apparatus for heat-processing a substrate. A heat processing apparatus may include: a substrate support having a seating surface for supporting a substrate; a heater installed inside the substrate support; and a vacuum insulating layer provided on the substrate supp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SA YOONKI, SONG JUN HO, GOH JUNGSUK, KIM JUNHO, LEE JAESEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides an apparatus for heat-processing a substrate. A heat processing apparatus may include: a substrate support having a seating surface for supporting a substrate; a heater installed inside the substrate support; and a vacuum insulating layer provided on the substrate support to block heat generated by the heater from being emitted in a direction other than the seating surface. The heat of the heating wire can reach the upper surface of the heating plate quickly and uniformly. 본 발명은 기판을 가열 처리하는 장치를 제공한다. 가열 처리 장치는 기판을 지지하는 안착면을 갖는 기판 지지체; 상기 기판 지지체 내부에 설치되는 히터; 및 상기 히터에서 발생되는 열이 상기 안착면을 제외한 다른 방향으로 방출되는 것을 차단하기 위해 상기 기판 지지체에 제공되는 진공 단열층을 포함할 수 있다.