금속 필름들의 증착

금속 필름들을 갖는 전자 디바이스들을 제공하기 위한 장치들 및 방법들이 제공된다. 본 개시내용의 일부 실시예들은 코발트를 포함하는 금속 필름으로 충전되는 라이너로서 금속성 텅스텐 층을 활용한다. 금속성 텅스텐 층은 코발트에 대한 우수한 접착력을 가져서, 향상된 코발트 갭-필 성능으로 이어진다. Apparatuses and methods to provide electronic devices having metal films are provided. Some embodiments of the disclosure utilize a met...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE SANG HYEOB, PABELICO CHRIS, PARK JIN HEE, TANG XIANMIN, LEI YU, HA TAE HONG, XU YI
Format:	Patent
Sprache:	kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!