CURABLE RESIN COMPOSITION DRY FILM CURED PRODUCT AND PRINTED WIRING BOARD

It is an object of the present invention to provide a curable resin composition in which the variation in the film thickness of a coating film before and after drying is small even in the case of a thin film and which does not cause a copper show-through phenomenon, wherein the curable resin composi...

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Bibliographische Detailangaben
Hauptverfasser:	YANAGIDA NOBUYUKI, ARAI YASUAKI, SHIRAKAWA KENICHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	It is an object of the present invention to provide a curable resin composition in which the variation in the film thickness of a coating film before and after drying is small even in the case of a thin film and which does not cause a copper show-through phenomenon, wherein the curable resin composition according to the present invention contains a curable resin and an extender pigment. The glossiness of the curable resin composition in a coating film having a film thickness of 12 μm after curing is in the range of 0.5 or more and 40.0 or less at 60°. When 0.3 g of the curable resin composition is mixed with 30 g of propylene glycol monomethyl ether acetate, the average particle diameter (D_50), measured with Microtrac, is 0.1 μm or more and 1.0 μm or less. In addition, the specific surface area (CS) is 10.0 m^2/ml or more. 본 발명은 박막시에도 건조전 도막이나 건조후 도막의 막두께의 편차가 작고, 구리 비침 현상이 발생하지 않는 경화성 수지 조성물의 제공을 과제로 하는 것으로, 본 발명에 의한 경화성 수지 조성물은 경화성 수지 및 체질 안료를 함유하는 경화성 수지 조성물로서, 상기 경화성 수지 조성물의 경화후 막두께 12㎛인 경화 도막에서의 60°의 광택도가 0.5 이상 40.0 이하의 범위 내이고, 상기 경화성 수지 조성물 0.3g을 프로필렌글리콜모노메틸에테르아세테이트 30g과 혼합하고, 마이크로트랙을 사용하여 측정했을 때의 평균 입자경(D50)이 0.1㎛ 이상 1.0㎛ 이하, 또한 비표면적(CS)이 10.0㎡/ml 이상인 것을 특징으로 한다.