ANNEALING SYSTEM AND METHOD

Provided is a system for annealing a substrate. The system includes: a first boiler having an input coupled to a water source; a second boiler having an input connected to the output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch pro...

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Bibliographische Detailangaben
Hauptverfasser:	CARLSON CHARLES T, DELMAS JEAN, VOPAT ROBERT BRENT
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Provided is a system for annealing a substrate. The system includes: a first boiler having an input coupled to a water source; a second boiler having an input connected to the output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal the plurality of substrates using steam from the second boiler. 기판들을 어닐링하기 위한 시스템이 제공된다. 시스템은, 수원에 커플링되는 입력을 갖는 제1 보일러; 제1 보일러의 출력에 연결되는 입력을 갖는 제2 보일러; 및 제2 보일러의 출력에 커플링되는 배치 프로세싱 챔버를 포함하며, 배치 프로세싱 챔버는, 제2 보일러로부터의 스팀을 사용하여 복수의 기판들을 어닐링하도록 구성된다.