기판 처리 장치, 기판 처리 방법 및 기억 매체

도포·현상 장치(2)는, 웨이퍼(W)의 주연부에 제거액을 토출하기 위한 제거액 노즐(52)을 가지는 제거액 공급부(50)와, 제거액 노즐(52)을 포함하는 이동체(51)를 이동시키는 구동부(60)와, 이동체(51)의 위치에 관한 정보를 검출하는 센서(70)와, 웨이퍼(W)의 주연(Wc) 밖에 제거액 노즐(52)을 배치하는 제 1 위치(P1)로부터 웨이퍼(W)의 주연부 상에 제거액 노즐(52)을 배치하는 제 2 위치(P2)로 이동체(51)를 이동시키기 위한 제어 지령을 구동부(60)에 출력하는 것과, 제 1 위치(P1)로부터 제 2...

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Hauptverfasser:	KAJIWARA HIDEKI, INADA HIROICHI, NAGAKANE TAKU, MIZUSHINO SHINICHI
Format:	Patent
Sprache:	kor
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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creator	KAJIWARA HIDEKI INADA HIROICHI NAGAKANE TAKU MIZUSHINO SHINICHI
description	도포·현상 장치(2)는, 웨이퍼(W)의 주연부에 제거액을 토출하기 위한 제거액 노즐(52)을 가지는 제거액 공급부(50)와, 제거액 노즐(52)을 포함하는 이동체(51)를 이동시키는 구동부(60)와, 이동체(51)의 위치에 관한 정보를 검출하는 센서(70)와, 웨이퍼(W)의 주연(Wc) 밖에 제거액 노즐(52)을 배치하는 제 1 위치(P1)로부터 웨이퍼(W)의 주연부 상에 제거액 노즐(52)을 배치하는 제 2 위치(P2)로 이동체(51)를 이동시키기 위한 제어 지령을 구동부(60)에 출력하는 것과, 제 1 위치(P1)로부터 제 2 위치(P2)로의 이동체(51)의 이동 도중에 센서(70)에 의해 검출된 정보와 제어 지령과의 관계에 기초하여, 이동체(51)의 이동 완료 위치와 제 2 위치(P2)와의 편차를 축소하도록 제어 지령을 보정하는 것을 실행하도록 구성되어 있는 제어부(100)를 구비한다. In the present invention, a coating/developing device (2) comprises: a removal liquid supply unit (50) having a removal liquid nozzle (52) for discharging a removal liquid on a peripheral edge section of a wafer (W); a drive unit (60) that moves a moving body (51) which includes the removal liquid nozzle (52); a sensor (70) that detects information related to the position of the moving body (51); and a control unit (100) configured so as to output, to the drive unit (60), a control command for moving the moving body (51) from a first position (P1) at which the removal liquid nozzle (52) is disposed outside the peripheral edge (Wc) of the wafer (W) to a second position (P2) at which the removal liquid nozzle (52) is disposed on the peripheral edge section of the wafer (W), and so as to correct the control command on the basis of the relationship between the control command and information detected by the sensor (70) in the course of movement of the moving body (51) from the first position (P1) to the second position (P2) such that a deviation is reduced between the second position (P2) and the position of the moving body (51) upon completion of movement.
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In the present invention, a coating/developing device (2) comprises: a removal liquid supply unit (50) having a removal liquid nozzle (52) for discharging a removal liquid on a peripheral edge section of a wafer (W); a drive unit (60) that moves a moving body (51) which includes the removal liquid nozzle (52); a sensor (70) that detects information related to the position of the moving body (51); and a control unit (100) configured so as to output, to the drive unit (60), a control command for moving the moving body (51) from a first position (P1) at which the removal liquid nozzle (52) is disposed outside the peripheral edge (Wc) of the wafer (W) to a second position (P2) at which the removal liquid nozzle (52) is disposed on the peripheral edge section of the wafer (W), and so as to correct the control command on the basis of the relationship between the control command and information detected by the sensor (70) in the course of movement of the moving body (51) from the first position (P1) to the second position (P2) such that a deviation is reduced between the second position (P2) and the position of the moving body (51) upon completion of movement.</description><language>kor</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPARATUS SPECIALLY ADAPTED THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201019&DB=EPODOC&CC=KR&NR=20200119312A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201019&DB=EPODOC&CC=KR&NR=20200119312A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAJIWARA HIDEKI</creatorcontrib><creatorcontrib>INADA HIROICHI</creatorcontrib><creatorcontrib>NAGAKANE TAKU</creatorcontrib><creatorcontrib>MIZUSHINO SHINICHI</creatorcontrib><title>기판 처리 장치, 기판 처리 방법 및 기억 매체</title><description>도포·현상 장치(2)는, 웨이퍼(W)의 주연부에 제거액을 토출하기 위한 제거액 노즐(52)을 가지는 제거액 공급부(50)와, 제거액 노즐(52)을 포함하는 이동체(51)를 이동시키는 구동부(60)와, 이동체(51)의 위치에 관한 정보를 검출하는 센서(70)와, 웨이퍼(W)의 주연(Wc) 밖에 제거액 노즐(52)을 배치하는 제 1 위치(P1)로부터 웨이퍼(W)의 주연부 상에 제거액 노즐(52)을 배치하는 제 2 위치(P2)로 이동체(51)를 이동시키기 위한 제어 지령을 구동부(60)에 출력하는 것과, 제 1 위치(P1)로부터 제 2 위치(P2)로의 이동체(51)의 이동 도중에 센서(70)에 의해 검출된 정보와 제어 지령과의 관계에 기초하여, 이동체(51)의 이동 완료 위치와 제 2 위치(P2)와의 편차를 축소하도록 제어 지령을 보정하는 것을 실행하도록 구성되어 있는 제어부(100)를 구비한다. In the present invention, a coating/developing device (2) comprises: a removal liquid supply unit (50) having a removal liquid nozzle (52) for discharging a removal liquid on a peripheral edge section of a wafer (W); a drive unit (60) that moves a moving body (51) which includes the removal liquid nozzle (52); a sensor (70) that detects information related to the position of the moving body (51); and a control unit (100) configured so as to output, to the drive unit (60), a control command for moving the moving body (51) from a first position (P1) at which the removal liquid nozzle (52) is disposed outside the peripheral edge (Wc) of the wafer (W) to a second position (P2) at which the removal liquid nozzle (52) is disposed on the peripheral edge section of the wafer (W), and so as to correct the control command on the basis of the relationship between the control command and information detected by the sensor (70) in the course of movement of the moving body (51) from the first position (P1) to the second position (P2) such that a deviation is reduced between the second position (P2) and the position of the moving body (51) upon completion of movement.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB5tWPD254JCm82zXi9bI3Cm3lL3-ycoaOAKvp6w8rXm6YCqX6QxJtpWxVeL1_yZtMWHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oS7x1kZGBkYGBoaGlsaORoTJwqAGiKQM4</recordid><startdate>20201019</startdate><enddate>20201019</enddate><creator>KAJIWARA HIDEKI</creator><creator>INADA HIROICHI</creator><creator>NAGAKANE TAKU</creator><creator>MIZUSHINO SHINICHI</creator><scope>EVB</scope></search><sort><creationdate>20201019</creationdate><title>기판 처리 장치, 기판 처리 방법 및 기억 매체</title><author>KAJIWARA HIDEKI ; INADA HIROICHI ; NAGAKANE TAKU ; MIZUSHINO SHINICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200119312A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2020</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KAJIWARA HIDEKI</creatorcontrib><creatorcontrib>INADA HIROICHI</creatorcontrib><creatorcontrib>NAGAKANE TAKU</creatorcontrib><creatorcontrib>MIZUSHINO SHINICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAJIWARA HIDEKI</au><au>INADA HIROICHI</au><au>NAGAKANE TAKU</au><au>MIZUSHINO SHINICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>기판 처리 장치, 기판 처리 방법 및 기억 매체</title><date>2020-10-19</date><risdate>2020</risdate><abstract>도포·현상 장치(2)는, 웨이퍼(W)의 주연부에 제거액을 토출하기 위한 제거액 노즐(52)을 가지는 제거액 공급부(50)와, 제거액 노즐(52)을 포함하는 이동체(51)를 이동시키는 구동부(60)와, 이동체(51)의 위치에 관한 정보를 검출하는 센서(70)와, 웨이퍼(W)의 주연(Wc) 밖에 제거액 노즐(52)을 배치하는 제 1 위치(P1)로부터 웨이퍼(W)의 주연부 상에 제거액 노즐(52)을 배치하는 제 2 위치(P2)로 이동체(51)를 이동시키기 위한 제어 지령을 구동부(60)에 출력하는 것과, 제 1 위치(P1)로부터 제 2 위치(P2)로의 이동체(51)의 이동 도중에 센서(70)에 의해 검출된 정보와 제어 지령과의 관계에 기초하여, 이동체(51)의 이동 완료 위치와 제 2 위치(P2)와의 편차를 축소하도록 제어 지령을 보정하는 것을 실행하도록 구성되어 있는 제어부(100)를 구비한다. In the present invention, a coating/developing device (2) comprises: a removal liquid supply unit (50) having a removal liquid nozzle (52) for discharging a removal liquid on a peripheral edge section of a wafer (W); a drive unit (60) that moves a moving body (51) which includes the removal liquid nozzle (52); a sensor (70) that detects information related to the position of the moving body (51); and a control unit (100) configured so as to output, to the drive unit (60), a control command for moving the moving body (51) from a first position (P1) at which the removal liquid nozzle (52) is disposed outside the peripheral edge (Wc) of the wafer (W) to a second position (P2) at which the removal liquid nozzle (52) is disposed on the peripheral edge section of the wafer (W), and so as to correct the control command on the basis of the relationship between the control command and information detected by the sensor (70) in the course of movement of the moving body (51) from the first position (P1) to the second position (P2) such that a deviation is reduced between the second position (P2) and the position of the moving body (51) upon completion of movement.</abstract><oa>free_for_read</oa></addata></record>
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subjects	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
title	기판 처리 장치, 기판 처리 방법 및 기억 매체
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