THERMOSETTING RELEASE COATING AND THERMOSETTING RELEASE COATING KIT
An object of the present disclosure is to provide a thermosetting release coating and a thermosetting release coating kit that can be cured in a short period of time even at a lower temperature than that in the past (for example, at for 1 minute at 80°C). The thermosetting release coating contains:...
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| description | An object of the present disclosure is to provide a thermosetting release coating and a thermosetting release coating kit that can be cured in a short period of time even at a lower temperature than that in the past (for example, at for 1 minute at 80°C). The thermosetting release coating contains: at least one of a melamine resin having a mononuclear content of 80% by mass or more, and a low molecular weight diol having a molecular weight of less than 100, and a low molecular weight triol having a molecular weight of less than 100; at least one of a denatured silicon resin containing at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an epoxy group, an amino group, and a mercapto group and a fluoro resin containing those functional group; and an acid catalyst. The thermosetting release coating kit comprises: a first agent comprising at least one of the melamine resin, the low molecular weight diol, and the low molecular weight triol, and at least one of the denatured silicon resin and the denatured fluoro resin; and a second agent comprising the acid catalyst.
본 개시는, 종래보다 저온에 있어서도 단시간(예를 들어 80℃에서 1분간)에 경화가 가능한 열경화성 이형 도료 및 열경화성 이형 도료 키트를 제공하는 것을 목적으로 한다. 열경화성 이형 도료는, 단핵체의 함유량이 80질량% 이상인 멜라민 수지와, 분자량이 100 미만인 저분자량 디올 및 분자량이 100 미만인 저분자량 트리올 중 적어도 1개와, 수산기, 카르복실기, 에폭시기, 아미노기, 및 메르캅토기로 이루어지는 군으로부터 선택되는 적어도 1개의 관능기를 함유하는 변성 실리콘 수지 및 이와 같은 관능기를 함유하는 불소 수지 중 적어도 1개와, 산촉매를 포함한다. 열경화성 이형 도료 키트는, 상기 멜라민 수지, 상기 저분자량 디올 및 상기 저분자량 트리올 중 적어도 1개, 그리고 상기 변성 실리콘 수지 및 상기 변성 불소 수지 중 적어도 1개를 포함하는 제1제와, 상기 산촉매를 포함하는 제2제를 포함한다. |
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본 개시는, 종래보다 저온에 있어서도 단시간(예를 들어 80℃에서 1분간)에 경화가 가능한 열경화성 이형 도료 및 열경화성 이형 도료 키트를 제공하는 것을 목적으로 한다. 열경화성 이형 도료는, 단핵체의 함유량이 80질량% 이상인 멜라민 수지와, 분자량이 100 미만인 저분자량 디올 및 분자량이 100 미만인 저분자량 트리올 중 적어도 1개와, 수산기, 카르복실기, 에폭시기, 아미노기, 및 메르캅토기로 이루어지는 군으로부터 선택되는 적어도 1개의 관능기를 함유하는 변성 실리콘 수지 및 이와 같은 관능기를 함유하는 불소 수지 중 적어도 1개와, 산촉매를 포함한다. 열경화성 이형 도료 키트는, 상기 멜라민 수지, 상기 저분자량 디올 및 상기 저분자량 트리올 중 적어도 1개, 그리고 상기 변성 실리콘 수지 및 상기 변성 불소 수지 중 적어도 1개를 포함하는 제1제와, 상기 산촉매를 포함하는 제2제를 포함한다.</description><language>eng ; kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200825&DB=EPODOC&CC=KR&NR=20200099996A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200825&DB=EPODOC&CC=KR&NR=20200099996A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TABUKA SADATERU</creatorcontrib><creatorcontrib>HIBINO KAZUYUKI</creatorcontrib><title>THERMOSETTING RELEASE COATING AND THERMOSETTING RELEASE COATING KIT</title><description>An object of the present disclosure is to provide a thermosetting release coating and a thermosetting release coating kit that can be cured in a short period of time even at a lower temperature than that in the past (for example, at for 1 minute at 80°C). The thermosetting release coating contains: at least one of a melamine resin having a mononuclear content of 80% by mass or more, and a low molecular weight diol having a molecular weight of less than 100, and a low molecular weight triol having a molecular weight of less than 100; at least one of a denatured silicon resin containing at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an epoxy group, an amino group, and a mercapto group and a fluoro resin containing those functional group; and an acid catalyst. The thermosetting release coating kit comprises: a first agent comprising at least one of the melamine resin, the low molecular weight diol, and the low molecular weight triol, and at least one of the denatured silicon resin and the denatured fluoro resin; and a second agent comprising the acid catalyst.
본 개시는, 종래보다 저온에 있어서도 단시간(예를 들어 80℃에서 1분간)에 경화가 가능한 열경화성 이형 도료 및 열경화성 이형 도료 키트를 제공하는 것을 목적으로 한다. 열경화성 이형 도료는, 단핵체의 함유량이 80질량% 이상인 멜라민 수지와, 분자량이 100 미만인 저분자량 디올 및 분자량이 100 미만인 저분자량 트리올 중 적어도 1개와, 수산기, 카르복실기, 에폭시기, 아미노기, 및 메르캅토기로 이루어지는 군으로부터 선택되는 적어도 1개의 관능기를 함유하는 변성 실리콘 수지 및 이와 같은 관능기를 함유하는 불소 수지 중 적어도 1개와, 산촉매를 포함한다. 열경화성 이형 도료 키트는, 상기 멜라민 수지, 상기 저분자량 디올 및 상기 저분자량 트리올 중 적어도 1개, 그리고 상기 변성 실리콘 수지 및 상기 변성 불소 수지 중 적어도 1개를 포함하는 제1제와, 상기 산촉매를 포함하는 제2제를 포함한다.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAO8XAN8vUPdg0J8fRzVwhy9XF1DHZVcPZ3BPMd_VwU8Kvw9gzhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkYGBgaWQGDmaEycKgD6aSyj</recordid><startdate>20200825</startdate><enddate>20200825</enddate><creator>TABUKA SADATERU</creator><creator>HIBINO KAZUYUKI</creator><scope>EVB</scope></search><sort><creationdate>20200825</creationdate><title>THERMOSETTING RELEASE COATING AND THERMOSETTING RELEASE COATING KIT</title><author>TABUKA SADATERU ; HIBINO KAZUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200099996A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>TABUKA SADATERU</creatorcontrib><creatorcontrib>HIBINO KAZUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TABUKA SADATERU</au><au>HIBINO KAZUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOSETTING RELEASE COATING AND THERMOSETTING RELEASE COATING KIT</title><date>2020-08-25</date><risdate>2020</risdate><abstract>An object of the present disclosure is to provide a thermosetting release coating and a thermosetting release coating kit that can be cured in a short period of time even at a lower temperature than that in the past (for example, at for 1 minute at 80°C). The thermosetting release coating contains: at least one of a melamine resin having a mononuclear content of 80% by mass or more, and a low molecular weight diol having a molecular weight of less than 100, and a low molecular weight triol having a molecular weight of less than 100; at least one of a denatured silicon resin containing at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an epoxy group, an amino group, and a mercapto group and a fluoro resin containing those functional group; and an acid catalyst. The thermosetting release coating kit comprises: a first agent comprising at least one of the melamine resin, the low molecular weight diol, and the low molecular weight triol, and at least one of the denatured silicon resin and the denatured fluoro resin; and a second agent comprising the acid catalyst.
본 개시는, 종래보다 저온에 있어서도 단시간(예를 들어 80℃에서 1분간)에 경화가 가능한 열경화성 이형 도료 및 열경화성 이형 도료 키트를 제공하는 것을 목적으로 한다. 열경화성 이형 도료는, 단핵체의 함유량이 80질량% 이상인 멜라민 수지와, 분자량이 100 미만인 저분자량 디올 및 분자량이 100 미만인 저분자량 트리올 중 적어도 1개와, 수산기, 카르복실기, 에폭시기, 아미노기, 및 메르캅토기로 이루어지는 군으로부터 선택되는 적어도 1개의 관능기를 함유하는 변성 실리콘 수지 및 이와 같은 관능기를 함유하는 불소 수지 중 적어도 1개와, 산촉매를 포함한다. 열경화성 이형 도료 키트는, 상기 멜라민 수지, 상기 저분자량 디올 및 상기 저분자량 트리올 중 적어도 1개, 그리고 상기 변성 실리콘 수지 및 상기 변성 불소 수지 중 적어도 1개를 포함하는 제1제와, 상기 산촉매를 포함하는 제2제를 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | THERMOSETTING RELEASE COATING AND THERMOSETTING RELEASE COATING KIT |
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