SEMICONDUCTOR DEVICE

A technology of the present invention includes a semiconductor device including a support structure penetrating a laminate including interlayer insulating films and electrode patterns alternately laminated and having a structure extending in a zigzag shape or having a curved unit. The semiconductor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHOI HYEOK JUN, HWANG JUN YEONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:A technology of the present invention includes a semiconductor device including a support structure penetrating a laminate including interlayer insulating films and electrode patterns alternately laminated and having a structure extending in a zigzag shape or having a curved unit. The semiconductor device can increase the structural stability. 본 기술은 교대로 적층된 층간 절연막들 및 전극패턴들을 포함하는 적층체를 관통하고, 지그재그 형태로 연장된 구조를 갖거나, 굴곡부를 갖는 지지구조를 포함하는 반도체 장치를 포함한다.