SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
The present invention relates to a semiconductor light emitting device. The semiconductor light emitting device comprises: at least one semiconductor light emitting device chip including a plurality of electrodes; a plurality of pads each corresponding to the plurality of electrodes of the at least...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a semiconductor light emitting device. The semiconductor light emitting device comprises: at least one semiconductor light emitting device chip including a plurality of electrodes; a plurality of pads each corresponding to the plurality of electrodes of the at least one semiconductor light emitting device chip while being spaced a predetermined distance apart from the plurality of electrodes on a plane; an electrical connection provided on the same plane as the plurality of pads and electrically connecting the plurality of pads and the plurality of electrodes, respectively; and an encapsulating material covering the at least one semiconductor light emitting device chip. According to the present invention, the semiconductor light emitting device has excellent visibility since the electrical connection is formed in a net shape to be formed thinner.
본 개시는 반도체 발광소자에 있어서, 복수의 전극을 포함하는 적어도 하나 이상의 반도체 발광소자 칩; 평면상에서 적어도 하나 이상의 반도체 발광소자 칩의 복수의 전극과 일정거리 떨어져 복수의 전극과 각각 대응되는 복수의 패드; 복수의 패드와 동일평면상에 구비되며, 복수의 패드와 복수의 전극 사이를 각각 전기적으로 연결하는 전기적 연결; 그리고, 적어도 하나 이상의 반도체 발광소자 칩을 덮는 봉지재;를 포함하는 반도체 발광소자에 관한 것이다. |
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